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ERJ8ENF1202V - Panasonic

Description: Panasonic ERJ8EN Series Precision Thick Film Surface Mount Resistor 1206 Case 12kΩ ±1% 0.25W ±100ppm/°C

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ERJ8ENF1202V - Panasonic PCB footprint - Other - Other - ERJ8EN
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ERJ8ENF1202V - Panasonic  - 3D model - Other - ERJ8EN
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ERJ8ENF1202V Details

  • Manufacturer Part Number:

    ERJ8ENF1202V

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    22 Weeks

  • Manufacturer:

    Panasonic Electronic Components

  • YTEOL:

    3

  • Additional Feature:

    PRECISION

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.6 mm

  • Package Length:

    3.2 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    1.6 mm

  • Packing Method:

    TR, PUNCHED, 7 INCH

  • Rated Power Dissipation (P):

    0.25 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200; IEC60115-8

  • Resistance:

    12000 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    1206

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    100 ppm/°C

  • Terminal Finish:

    MATTE TIN OVER NICKEL

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    200 V

ERJ8ENF1202V Frequently Asked Questions (FAQs)

  • The recommended land pattern for ERJ8ENF1202V is a rectangular pad with a size of 1.3mm x 1.3mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask clearance of 0.1mm.
  • To handle thermal considerations for ERJ8ENF1202V, ensure good thermal conduction by using a thermal pad or a heat sink, and keep the component away from heat sources. The maximum operating temperature is 125°C, and the thermal resistance (Rth) is 250°C/W.
  • The recommended soldering profile for ERJ8ENF1202V is a reflow soldering process with a peak temperature of 260°C, a dwell time above 220°C of 30-60 seconds, and a cooling rate of 3-5°C/second.
  • Yes, ERJ8ENF1202V is compatible with lead-free soldering. It is RoHS compliant and can be soldered using lead-free solder alloys such as SnAgCu.
  • The moisture sensitivity level (MSL) of ERJ8ENF1202V is MSL 2, which means it can withstand exposure to moisture for up to 4 days at 30°C and 60% relative humidity.

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ERJ8ENF1202V Overview

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Part Image NRC12F1202TRF NIC Components Corp

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Part Image RK73H2BRTBK1202F KOA Corporation

RES,SMT,THICK FILM,12K OHMS,200WV,1% +/-TOL,-100,100PPM TC,1206 CASE

Part Image RMCA1206FT12K0 SEI Stackpole Electronics Inc

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Part Image PWR06FVGO1202A Viking Tech Corp

Fixed Resistor, Metal Glaze/thick Film, 0.3333W, 12000ohm, 200V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 1206, CHIP

Part Image PWR06FVEO1202N Viking Tech Corp

Fixed Resistor, Metal Glaze/thick Film, 0.333W, 12000ohm, 200V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 1206, CHIP

For a full list of alternate parts for ERJ8ENF1202V, check out Findchips.com