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ERJ8ENF1241V - Panasonic

Description: PANASONIC ELECTRONIC COMPONENTS - ERJ8ENF1241V - RES, THICK FILM, 1K24, 1%, 0.25W, 1206

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ERJ8ENF1241V - Panasonic PCB footprint - Other - Other - ERJ8EN
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ERJ8ENF1241V Details

  • Manufacturer Part Number:

    ERJ8ENF1241V

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    61 Weeks, 1 Day

  • Manufacturer:

    Panasonic Electronic Components

  • YTEOL:

    3

  • Additional Feature:

    PRECISION

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.6 mm

  • Package Length:

    3.2 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    1.6 mm

  • Packing Method:

    TR, PUNCHED, 7 INCH

  • Rated Power Dissipation (P):

    0.25 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200; IEC60115-8

  • Resistance:

    1240 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    1206

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    100 ppm/°C

  • Terminal Finish:

    MATTE TIN OVER NICKEL

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    200 V

ERJ8ENF1241V Frequently Asked Questions (FAQs)

  • The recommended land pattern for ERJ8ENF1241V is a rectangular pad with a size of 1.3mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask clearance of 0.1mm.
  • To handle thermal considerations for ERJ8ENF1241V, ensure that the component is placed on a thermal pad or a copper pour with a sufficient thermal conductivity. The thermal pad should be connected to a ground plane or a heat sink to dissipate heat efficiently.
  • The maximum power rating for ERJ8ENF1241V is 0.25W. However, it's essential to consider the operating conditions, such as ambient temperature and airflow, to ensure that the component does not exceed its maximum power rating.
  • Yes, ERJ8ENF1241V can be used in high-frequency applications up to 100MHz. However, it's crucial to consider the component's self-resonant frequency, which is around 200MHz, and ensure that the operating frequency is below this value to avoid resonance issues.
  • To ensure the reliability of ERJ8ENF1241V in a humid environment, apply a conformal coating to the component and the surrounding area. This will help to prevent moisture ingress and reduce the risk of corrosion or electrical failures.

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ERJ8ENF1241V Overview

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Part Image FCF06FT-1241 Prosperity Dielectrics Co Ltd

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Part Image RMS12R-1K24-F RFE International Inc

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Part Image RM12F1241CTDK Cal-Chip Electronics

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For a full list of alternate parts for ERJ8ENF1241V, check out Findchips.com