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ERJ8ENF24R9V - Panasonic

Description: Panasonic ERJ8EN Series Precision Thick Film Surface Mount Fixed Resistor 1206 Case 24.9Ω ±1% 0.25W ±100ppm/°C

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ERJ8ENF24R9V - Panasonic - PCB symbol
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ERJ8ENF24R9V - Panasonic PCB footprint - Other - Other - ERJ8EN
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ERJ8ENF24R9V - Panasonic - 3D model - Other - ERJ8EN
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ERJ8ENF24R9V Details

  • Manufacturer Part Number:

    ERJ8ENF24R9V

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    22 Weeks

  • Manufacturer:

    Panasonic Electronic Components

  • YTEOL:

    3

  • Additional Feature:

    PRECISION

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.6 mm

  • Package Length:

    3.2 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    1.6 mm

  • Packing Method:

    TR, PUNCHED, 7 INCH

  • Rated Power Dissipation (P):

    0.25 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200; IEC60115-8

  • Resistance:

    24.9 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    1206

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    100 ppm/°C

  • Terminal Finish:

    MATTE TIN OVER NICKEL

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    200 V

ERJ8ENF24R9V Frequently Asked Questions (FAQs)

  • The recommended land pattern for ERJ8ENF24R9V is a rectangular pad with a size of 1.3mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask clearance of 0.1mm.
  • To handle thermal considerations for ERJ8ENF24R9V, ensure good thermal conduction by using a thermal pad or a heat sink, and keep the component away from heat sources. The maximum operating temperature is 125°C, and the thermal resistance (Rth) is 250°C/W.
  • The recommended soldering profile for ERJ8ENF24R9V is a reflow soldering process with a peak temperature of 260°C, a dwell time above 220°C of 30-60 seconds, and a cooling rate of 4°C/s or less.
  • Yes, ERJ8ENF24R9V is designed to withstand vibrations up to 10G (10Hz-2kHz) and can be used in high-vibration environments. However, it's recommended to follow proper mounting and soldering techniques to ensure reliability.
  • To ensure the reliability of ERJ8ENF24R9V in humid environments, follow proper storage and handling procedures, and use a moisture-sensitive device (MSD) control system. The component is classified as MSL 2a, with a floor life of 1 year at 30°C/60% RH.

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ERJ8ENF24R9V Overview

Use the download button to access the ERJ8ENF24R9V schematic symbol, PCB footprint, and 3D model.
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ERJ8ENF24R9V Alternates

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Part Image FWF06FT-24R9-W Prosperity Dielectrics Co Ltd

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Part Image ERJS08F24R9V Panasonic Electronic Components

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Part Image RC1206FRF1324R9 YAGEO Corporation

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