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ERJ8ENF30R0V - Panasonic

Description: Thick Film Chip Resistor 0.25W 1206 30K Panasonic ERJ Series Precision Thick Film Surface Mount Resistor 1206 Case 30Ω ±1% 0.25W ±100ppm/°C

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ERJ8ENF30R0V - Panasonic - PCB symbol
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ERJ8ENF30R0V - Panasonic PCB footprint - Other - Other - ERJ8EN
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ERJ8ENF30R0V - Panasonic - 3D model - Other - ERJ8EN
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ERJ8ENF30R0V Details

  • Manufacturer Part Number:

    ERJ8ENF30R0V

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    22 Weeks

  • Manufacturer:

    Panasonic Electronic Components

  • YTEOL:

    3

  • Additional Feature:

    PRECISION

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.6 mm

  • Package Length:

    3.2 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    1.6 mm

  • Packing Method:

    TR, PUNCHED, 7 INCH

  • Rated Power Dissipation (P):

    0.25 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200; IEC60115-8

  • Resistance:

    30 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    1206

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    100 ppm/°C

  • Terminal Finish:

    MATTE TIN OVER NICKEL

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    200 V

ERJ8ENF30R0V Frequently Asked Questions (FAQs)

  • The recommended land pattern for ERJ8ENF30R0V is a rectangular pad with a size of 1.3mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask clearance of 0.1mm.
  • During reflow soldering, the ERJ8ENF30R0V should be placed on a flat, even surface to prevent warping or deformation. The component should be aligned with the PCB pads and secured with a gentle pressure to ensure proper solder wetting. The recommended reflow temperature profile is 260°C peak temperature with a 3-5°C/s ramp rate.
  • The maximum power rating for ERJ8ENF30R0V is 0.5W. Exceeding this rating may cause the component to overheat, leading to reduced performance or even failure.
  • Yes, ERJ8ENF30R0V is suitable for high-frequency applications up to 1GHz. However, it's essential to consider the component's self-resonant frequency, which is around 500MHz, and take necessary precautions to minimize parasitic effects.
  • ERJ8ENF30R0V has a moisture sensitivity level (MSL) of 3, which means it can withstand normal humidity levels. However, it's recommended to follow proper storage and handling procedures to prevent moisture absorption, especially in high-humidity environments.

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ERJ8ENF30R0V Overview

Use the download button to access the ERJ8ENF30R0V schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like ERJ8E, or try a keyword search, such as Fixed Resistors

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