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ERJ8ENF3322V - Panasonic

Description: PANASONIC - ERJ8ENF3322V - RES, 33K2, 1%, 0.25W, 1206, THICK FILM

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ERJ8ENF3322V - Panasonic - PCB symbol
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PCB Footprints
ERJ8ENF3322V - Panasonic PCB footprint - Other - Other - ERJ8EN
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3D Models
ERJ8ENF3322V - Panasonic - 3D model - Other - ERJ8EN
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ERJ8ENF3322V Details

  • Manufacturer Part Number:

    ERJ8ENF3322V

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    61 Weeks, 1 Day

  • Manufacturer:

    Panasonic Electronic Components

  • YTEOL:

    3

  • Additional Feature:

    PRECISION

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.6 mm

  • Package Length:

    3.2 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    1.6 mm

  • Packing Method:

    TR, PUNCHED, 7 INCH

  • Rated Power Dissipation (P):

    0.25 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200; IEC60115-8

  • Resistance:

    33200 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    1206

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    100 ppm/°C

  • Terminal Finish:

    MATTE TIN OVER NICKEL

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    200 V

ERJ8ENF3322V Frequently Asked Questions (FAQs)

  • The recommended land pattern for ERJ8ENF3322V is a rectangular pad with a size of 1.3mm x 1.3mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask clearance of 0.1mm.
  • During reflow soldering, the ERJ8ENF3322V should be placed on a flat surface to prevent tombstoning. The component should be aligned with the PCB pads and the solder paste should be applied evenly. The recommended reflow temperature profile is 250°C for 10-30 seconds.
  • Yes, the ERJ8ENF3322V is suitable for high-frequency applications up to 1 GHz. However, it's recommended to use a suitable PCB layout and impedance matching to minimize signal loss and ensure optimal performance.
  • The ERJ8ENF3322V is rated for operation up to 125°C. However, it's recommended to derate the component's power rating and consider the thermal resistance of the PCB and surrounding components when operating in high-temperature environments.
  • To ensure the ERJ8ENF3322V meets your specific application's requirements, it's recommended to review the datasheet and consult with Panasonic's application notes and technical support team. Additionally, consider performing simulation and testing to validate the component's performance in your specific application.

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ERJ8ENF3322V Overview

Use the download button to access the ERJ8ENF3322V schematic symbol, PCB footprint, and 3D model.
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