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ERJ8ENF6812V - Panasonic

Description: PANASONIC - ERJ8ENF6812V - RES, 68K1, 1%, 0.25W, 1206, THICK FILM

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ERJ8ENF6812V - Panasonic - PCB symbol
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PCB Footprints
ERJ8ENF6812V - Panasonic PCB footprint - Other - Other - ERJ8EN
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3D Models
ERJ8ENF6812V - Panasonic - 3D model - Other - ERJ8EN
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ERJ8ENF6812V Details

  • Manufacturer Part Number:

    ERJ8ENF6812V

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    65 Weeks, 1 Day

  • Manufacturer:

    Panasonic Electronic Components

  • YTEOL:

    3

  • Additional Feature:

    PRECISION

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.6 mm

  • Package Length:

    3.2 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    1.6 mm

  • Packing Method:

    TR, PUNCHED, 7 INCH

  • Rated Power Dissipation (P):

    0.25 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200; IEC60115-8

  • Resistance:

    68100 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    1206

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    100 ppm/°C

  • Terminal Finish:

    MATTE TIN OVER NICKEL

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    200 V

ERJ8ENF6812V Frequently Asked Questions (FAQs)

  • The recommended land pattern for ERJ8ENF6812V is a rectangular pad with a size of 1.3mm x 1.3mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask clearance of 0.1mm.
  • During reflow soldering, the ERJ8ENF6812V should be placed on a flat surface to prevent tombstoning. The component should be aligned with the PCB pads and the solder paste should be applied evenly. The recommended reflow temperature profile is 250°C for 10-30 seconds.
  • The maximum power rating for ERJ8ENF6812V is 0.5W. However, the actual power rating may vary depending on the operating conditions and the PCB design. It is recommended to derate the power rating by 20-30% to ensure reliable operation.
  • Yes, ERJ8ENF6812V is compatible with lead-free soldering. The component is designed to withstand the higher temperatures required for lead-free soldering, and it meets the requirements of the RoHS directive.
  • The moisture sensitivity level (MSL) of ERJ8ENF6812V is MSL 2, which means that the component can withstand exposure to moisture for up to 4 days at 30°C and 60% relative humidity.

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ERJ8ENF6812V Overview

Use the download button to access the ERJ8ENF6812V schematic symbol, PCB footprint, and 3D model.
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ERJ8ENF6812V Alternates

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Part Image RK73H2BTTD6812F KOA Speer Electronics Inc

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Part Image 232272476813 YAGEO Corporation

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Part Image RK73H2BGBC6812F KOA Speer Electronics Inc

Fixed Resistor, Metal Glaze/thick Film, 0.25W, 68100ohm, 200V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 1206
Part Image 232272466813L YAGEO Corporation

Fixed Resistor, Metal Glaze/thick Film, 0.25W, 68100ohm, 200V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 1206
For a full list of alternate parts for ERJ8ENF6812V, check out Findchips.com