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ERJB3CFR027V - Panasonic

Description: Panasonic ERJB3 Series Thick Film Fixed Resistor 0508 Case 27mΩ ±1% 0.5W 0 → +300ppm/°C

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Symbol
ERJB3CFR027V - Panasonic - PCB symbol
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PCB Footprints
ERJB3CFR027V - Panasonic PCB footprint - Other - Other - ERJB3_(0508)
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3D Models
ERJB3CFR027V - Panasonic - 3D model - Other - ERJB3_(0508)
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ERJB3CFR027V Details

  • Manufacturer Part Number:

    ERJB3CFR027V

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Panasonic Electronic Components

  • YTEOL:

    12

  • Construction:

    Rectangular

  • First Element Resistance:

    0.027 Ω

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Network Type:

    ISOLATED

  • Number of Elements:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.5 mm

  • Package Length:

    1.25 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    2 mm

  • Packing Method:

    TR, PUNCHED, 7 INCH

  • Rated Power Dissipation (P):

    0.5 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200

  • Resistance:

    0.027 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    0508

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    0,300 ppm/°C

  • Terminal Finish:

    TIN

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    150 V

ERJB3CFR027V Frequently Asked Questions (FAQs)

  • The recommended land pattern for ERJB3CFR027V is a rectangular pad with a size of 1.3mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask clearance of 0.1mm.
  • To handle thermal considerations for ERJB3CFR027V, ensure that the component is placed on a thermally conductive substrate, and provide adequate thermal vias to dissipate heat. The recommended thermal resistance (Rth) is 100°C/W, and the maximum operating temperature is 125°C.
  • The recommended reflow soldering profile for ERJB3CFR027V is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C. The recommended soldering process is a lead-free reflow process with a nitrogen atmosphere.
  • No, ERJB3CFR027V is not compatible with wave soldering due to its small size and low thermal mass. It is recommended to use reflow soldering or other surface mount technology (SMT) compatible soldering processes.
  • The moisture sensitivity level (MSL) of ERJB3CFR027V is MSL 3, which means it can withstand a maximum exposure of 168 hours at 30°C and 60% relative humidity before soldering.

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ERJB3CFR027V Overview

Use the download button to access the ERJB3CFR027V schematic symbol, PCB footprint, and 3D model.
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