The recommended land pattern for ERJC1CFR068U is a rectangular pad with a size of 1.3mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask clearance of 0.1mm.
To handle thermal considerations for ERJC1CFR068U, ensure that the component is mounted on a thermally conductive substrate, and provide adequate thermal vias to dissipate heat. The recommended thermal resistance (Rth) is 250°C/W, and the maximum operating temperature is 125°C.
The recommended soldering profile for ERJC1CFR068U is a reflow profile with a peak temperature of 260°C, a dwell time above 220°C of 30-60 seconds, and a cooling rate of 3-5°C/second. Hand soldering is not recommended.
Yes, ERJC1CFR068U is designed to withstand high-vibration environments. However, it's essential to ensure that the component is properly mounted and secured to the PCB to prevent mechanical stress and damage.
To ensure the reliability of ERJC1CFR068U in a humid environment, apply a conformal coating to the PCB, and ensure that the component is stored in a dry environment before assembly. The component is rated for 85°C/85% RH, but it's recommended to follow the IPC-J-STD-020 standard for moisture sensitivity.
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ERJC1CFR068U Overview
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