ERJP06F22R1V footprint, schematic symbol and 3D model by Panasonic

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ERJP06F22R1V Details

The recommended land pattern for ERJP06F22R1V is a rectangular pad with a size of 1.3mm x 1.3mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask clearance of 0.1mm.
To handle thermal considerations for ERJP06F22R1V, ensure good thermal conduction by using a thermal pad or a heat sink. The component's thermal resistance (Rth) is 35°C/W, and the operating temperature range is -55°C to 150°C. Keep the component away from heat sources and ensure good airflow.
The recommended soldering profile for ERJP06F22R1V is a reflow soldering process with a peak temperature of 260°C, a dwell time above 220°C of 30-60 seconds, and a cooling rate of 3-5°C/s. Avoid wave soldering and hand soldering.
To ensure the reliability of ERJP06F22R1V in high-vibration applications, use a secure mounting method such as adhesive or screw mounting. Ensure the component is properly secured to the PCB and that the PCB is designed to withstand the vibration. Additionally, consider using a vibration-resistant component or a vibration-dampening material.
The equivalent series resistance (ESR) of ERJP06F22R1V is 0.22 ohms at 100 kHz. This value is important for impedance calculations and filter design.

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