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ERJP06F3301V - Panasonic

Description: Panasonic ERJP06 Series Thick Film Surface Mount Resistor 0805 Case 3.3kΩ ±1% 0.5W ±100ppm/°C

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ERJP06F3301V - Panasonic PCB footprint - Other - Other - ERJP06(0805)
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ERJP06F3301V - Panasonic  - 3D model - Other - ERJP06(0805)
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ERJP06F3301V Details

  • Manufacturer Part Number:

    ERJP06F3301V

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan, Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    Panasonic Electronic Components

  • YTEOL:

    12

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.6 mm

  • Package Length:

    2 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    1.25 mm

  • Packing Method:

    TR, PUNCHED, 7 INCH

  • Rated Power Dissipation (P):

    0.5 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200, IEC60115-8

  • Resistance:

    3300 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    0805

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    100 ppm/°C

  • Terminal Finish:

    MATTE TIN OVER NICKEL

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    400 V

ERJP06F3301V Frequently Asked Questions (FAQs)

  • The recommended land pattern for ERJP06F3301V is a rectangular pad with a size of 1.5mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape.
  • To handle thermal considerations, ensure good thermal conduction by using a thermal pad on the PCB, and consider using a heat sink or thermal interface material if high power dissipation is expected.
  • The recommended soldering temperature profile for ERJP06F3301V is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C.
  • Yes, ERJP06F3301V can be used in high-frequency applications up to 1 GHz, but impedance matching and PCB layout considerations are crucial to minimize signal loss and reflections.
  • To ensure reliability, follow proper storage and handling procedures, and consider using conformal coating or potting to protect the component from moisture and contaminants.

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ERJP06F3301V Overview

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Part Image PWR05FVEU3301A Viking Tech Corp

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Part Image RPCA0805FT3K30-UP SEI Stackpole Electronics Inc

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For a full list of alternate parts for ERJP06F3301V, check out Findchips.com