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ERJP06F3601V - Panasonic

Description: Panasonic ERJP06 Series Thick Film Surface Mount Resistor 805 Case 3.6kΩ ±1% 0.5W ±100ppm/°C

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ERJP06F3601V - Panasonic - PCB symbol
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PCB Footprints
ERJP06F3601V - Panasonic PCB footprint - Other - Other - ERJP06(0805)
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3D Models
ERJP06F3601V - Panasonic - 3D model - Other - ERJP06(0805)
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ERJP06F3601V Details

  • Manufacturer Part Number:

    ERJP06F3601V

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan, Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    Panasonic Electronic Components

  • YTEOL:

    12

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.6 mm

  • Package Length:

    2 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    1.25 mm

  • Packing Method:

    TR, PUNCHED, 7 INCH

  • Rated Power Dissipation (P):

    0.5 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200, IEC60115-8

  • Resistance:

    3600 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    0805

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    100 ppm/°C

  • Terminal Finish:

    MATTE TIN OVER NICKEL

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    400 V

ERJP06F3601V Frequently Asked Questions (FAQs)

  • The recommended land pattern for ERJP06F3601V is a rectangular pad with a size of 1.3mm x 0.8mm, with a 0.2mm gap between pads. It's essential to follow the recommended land pattern to ensure reliable soldering and prevent thermal issues.
  • While ERJP06F3601V has a high operating temperature range of -55°C to 150°C, it's essential to consider the derating curve and thermal resistance to ensure the component doesn't exceed its maximum junction temperature. Consult with a thermal expert or perform thermal simulations to ensure safe operation.
  • ERJP06F3601V is a moisture-sensitive device. To prevent damage, store the components in a dry environment (less than 20% RH) and follow the recommended baking procedure before reflow soldering. Use a nitrogen-filled packaging or desiccant to maintain a dry environment during storage.
  • The recommended reflow soldering profile for ERJP06F3601V is a peak temperature of 260°C, with a ramp-up rate of 3°C/s, a dwell time of 30-60 seconds, and a cool-down rate of 6°C/s. However, it's essential to consult the datasheet and follow the manufacturer's recommended reflow profile to ensure reliable soldering.
  • While ERJP06F3601V is a robust component, it's essential to consider the mechanical stress and vibration tolerance in your application. Consult with a mechanical engineer or perform FEA simulations to ensure the component can withstand the expected mechanical stress and vibration.

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ERJP06F3601V Overview

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