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ERJP08F1000V - Panasonic

Description: Panasonic ERJP08 Series Thick Film Surface Mount Resistor 1206 Case 100Ω ±1% 0.66W ±100ppm/°C

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Symbol
ERJP08F1000V - Panasonic - PCB symbol
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PCB Footprints
ERJP08F1000V - Panasonic PCB footprint - Other - Other - ERJP08(1206)
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3D Models
ERJP08F1000V - Panasonic - 3D model - Other - ERJP08(1206)
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ERJP08F1000V Details

  • Manufacturer Part Number:

    ERJP08F1000V

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    22 Weeks

  • Manufacturer:

    Panasonic Electronic Components

  • YTEOL:

    12

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.6 mm

  • Package Length:

    3.2 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    1.6 mm

  • Packing Method:

    TR, PUNCHED, 7 INCH

  • Rated Power Dissipation (P):

    0.66 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200; IEC60115-8

  • Resistance:

    100 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    1206

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    100 ppm/°C

  • Terminal Finish:

    MATTE TIN OVER NICKEL

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    500 V

ERJP08F1000V Frequently Asked Questions (FAQs)

  • The recommended land pattern for ERJP08F1000V is a rectangular pad with a size of 2.5mm x 1.25mm, with a non-solder mask defined (NSMD) pad shape.
  • To handle thermal considerations, ensure good thermal conduction by using a thermal pad or a heat sink, and avoid overheating by keeping the operating temperature within the recommended range of -55°C to 150°C.
  • The recommended soldering profile for ERJP08F1000V is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C, and a cooling rate of 4°C/s or less.
  • Yes, ERJP08F1000V can be used in high-frequency applications up to 1 GHz, but it's essential to consider the self-resonant frequency and the impedance characteristics to ensure optimal performance.
  • To ensure reliability, follow the recommended storage and handling procedures, and consider the operating conditions, such as temperature, humidity, and vibration, to ensure the component can withstand the environmental stresses.

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ERJP08F1000V Overview

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