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ERJP08F1212V - Panasonic

Description: Anti-Surge Thick Film Chip Resistor, 1206, 0.66W

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Symbol
ERJP08F1212V - Panasonic - PCB symbol
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PCB Footprints
ERJP08F1212V - Panasonic PCB footprint - Other - Other - ERJP08(1206)
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3D Models
ERJP08F1212V - Panasonic - 3D model - Other - ERJP08(1206)
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ERJP08F1212V Details

  • Manufacturer Part Number:

    ERJP08F1212V

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    22 Weeks

  • Manufacturer:

    Panasonic Electronic Components

  • YTEOL:

    12

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.6 mm

  • Package Length:

    3.2 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    1.6 mm

  • Packing Method:

    TR, PUNCHED, 7 INCH

  • Rated Power Dissipation (P):

    0.66 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200, IEC60115-8

  • Resistance:

    12100 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    1206

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    100 ppm/°C

  • Terminal Finish:

    MATTE TIN OVER NICKEL

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    500 V

ERJP08F1212V Frequently Asked Questions (FAQs)

  • The recommended land pattern for ERJP08F1212V is a rectangular pad with a size of 1.3mm x 1.3mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask clearance of 0.1mm.
  • To handle thermal considerations for ERJP08F1212V, ensure good thermal conduction by using a thermal pad or a heat sink, and keep the component away from heat sources. The maximum operating temperature is 125°C, and the thermal resistance (Rth) is 35°C/W.
  • The recommended soldering profile for ERJP08F1212V is a reflow soldering process with a peak temperature of 260°C, a dwell time above 220°C of 20-30 seconds, and a cooling rate of 3-5°C/s.
  • Yes, ERJP08F1212V is designed to withstand vibrations up to 10G (10Hz-2kHz) and can be used in high-vibration environments. However, it's recommended to follow proper mounting and soldering techniques to ensure reliability.
  • Yes, ERJP08F1212V is compatible with lead-free soldering and is RoHS compliant. It can be soldered using Sn-Ag-Cu (SAC) or other lead-free solder alloys.

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ERJP08F1212V Overview

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