ERJP08F2613V footprint, schematic symbol and 3D model by Panasonic

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ERJP08F2613V Details

The recommended land pattern for ERJP08F2613V is a rectangular pad with a size of 1.3mm x 1.3mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask clearance of 0.1mm.
To handle thermal considerations for ERJP08F2613V, ensure good thermal conduction by using a thermal pad or via under the component. Keep the component away from heat sources and ensure good airflow around the component. The maximum operating temperature is 125°C, so ensure the component is not exposed to temperatures above this.
The recommended soldering process for ERJP08F2613V is a reflow soldering process with a peak temperature of 260°C and a dwell time of 30-60 seconds. Ensure the component is soldered within the recommended temperature range to prevent damage.
To ensure the reliability of ERJP08F2613V in high-vibration applications, ensure the component is properly secured to the PCB using a suitable adhesive or mechanical fastening method. Additionally, consider using a vibration-resistant mounting method, such as a flexure-based mounting system.
The equivalent series resistance (ESR) of ERJP08F2613V is approximately 0.015 ohms. This value is not explicitly stated in the datasheet, but it can be estimated based on the component's internal construction and materials.

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