The recommended land pattern for ERJP08F3900V is a rectangular pad with a size of 1.3mm x 1.3mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask clearance of 0.1mm.
To handle thermal considerations for ERJP08F3900V, ensure good thermal conduction by using a thermal pad or a heat sink. The component's thermal resistance (Rth) is 35°C/W, so it's essential to provide adequate heat dissipation to prevent overheating.
The recommended soldering profile for ERJP08F3900V is a reflow soldering process with a peak temperature of 260°C, a dwell time above 220°C of 30-60 seconds, and a cooling rate of 3-5°C/s. Avoid wave soldering or hand soldering, as they may cause damage to the component.
While ERJP08F3900V is a robust component, it's essential to consider the vibration environment. Panasonic recommends a vibration test according to IEC 60068-2-6 to ensure the component's reliability. Additionally, consider using a vibration-resistant mounting method, such as a screw-down or adhesive mounting, to secure the component.
To ensure the reliability of ERJP08F3900V in a humid environment, follow Panasonic's recommended moisture sensitivity level (MSL) of 3. Store the components in a dry environment, and avoid exposing them to moisture during handling and assembly. If the component is exposed to moisture, follow the recommended baking procedure before assembly.
Trust Checks
This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored
ERJP08F3900V Overview
Use the download button to access the ERJP08F3900V schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like ERJP0,
or try a keyword search, such as Fixed Resistors
