ERJP08F4701V footprint, schematic symbol and 3D model by Panasonic

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ERJP08F4701V Details

The recommended land pattern for ERJP08F4701V is a rectangular pad with a size of 2.5mm x 1.25mm, with a non-solder mask defined (NSMD) pad shape.
To handle thermal considerations, ensure good thermal conduction by using a thermal pad on the PCB, and consider using a heat sink or thermal interface material if high power dissipation is expected.
The recommended soldering temperature profile for ERJP08F4701V is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C.
Yes, ERJP08F4701V is designed to withstand high-vibration environments, but it's recommended to follow Panasonic's guidelines for vibration testing and to ensure proper PCB design and assembly.
To ensure reliability in humid environments, follow Panasonic's guidelines for moisture sensitivity, and consider using a moisture-resistant coating or conformal coating on the PCB.

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