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ERJP14F2213U - Panasonic

Description: Panasonic ERJP14 Series Thick Film Fixed Resistor 1210 Case 221kΩ ±1% 0.5W ±100ppm/°C

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ERJP14F2213U - Panasonic - PCB symbol
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PCB Footprints
ERJP14F2213U - Panasonic PCB footprint - Other - Other - ERJP14 (1210)
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3D Models
ERJP14F2213U - Panasonic - 3D model - Other - ERJP14 (1210)
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ERJP14F2213U Details

  • Manufacturer Part Number:

    ERJP14F2213U

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    22 Weeks

  • Manufacturer:

    Panasonic Electronic Components

  • YTEOL:

    12

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.6 mm

  • Package Length:

    3.2 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    2.5 mm

  • Packing Method:

    TR, EMBOSSED, 7 INCH

  • Rated Power Dissipation (P):

    0.5 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200, IEC60115-8

  • Resistance:

    221000 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    1210

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    100 ppm/°C

  • Terminal Finish:

    Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    200 V

ERJP14F2213U Frequently Asked Questions (FAQs)

  • The recommended land pattern for ERJP14F2213U is a rectangular pad with a size of 2.5mm x 1.25mm, with a non-solder mask defined (NSMD) pad shape. This ensures proper soldering and minimizes the risk of solder bridging.
  • While ERJP14F2213U has a rated operating temperature range of -55°C to 125°C, it's essential to consider the derating curve and ensure that the component doesn't exceed its maximum power rating at elevated temperatures. Consult with Panasonic's application notes for specific guidance.
  • ERJP14F2213U is a moisture-sensitive device. To prevent damage, store the components in a dry environment (less than 30% RH) and follow the recommended baking procedure before reflow soldering. Consult Panasonic's packaging and storage guidelines for more information.
  • The recommended reflow soldering profile for ERJP14F2213U is a peak temperature of 260°C, with a dwell time of 30-60 seconds above 220°C. Ensure that the temperature ramp-up rate is 3°C/s or less to prevent thermal shock.
  • ERJP14F2213U is not AEC-Q200 qualified. If your design requires AEC-Q200 compliance, consider using an alternative component that meets the necessary automotive standards.

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ERJP14F2213U Overview

Use the download button to access the ERJP14F2213U schematic symbol, PCB footprint, and 3D model.
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