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ERJPA2F1001X - Panasonic

Description: PANASONIC ELECTRONIC COMPONENTS - ERJPA2F1001X - RES, AEC-Q200, THICK FILM, 1K, 0402

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Symbol
ERJPA2F1001X - Panasonic - PCB symbol
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PCB Footprints
ERJPA2F1001X - Panasonic PCB footprint - Other - Other - ERJPA2_(0402)
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3D Models
ERJPA2F1001X - Panasonic - 3D model - Other - ERJPA2_(0402)
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ERJPA2F1001X Details

  • Manufacturer Part Number:

    ERJPA2F1001X

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Panasonic Electronic Components

  • YTEOL:

    13

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.35 mm

  • Package Length:

    1 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    0.5 mm

  • Packing Method:

    TR, PUNCHED, 7 INCH

  • Rated Power Dissipation (P):

    0.2 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200, IEC60115-8

  • Resistance:

    1000 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    0402

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    100 ppm/°C

  • Terminal Finish:

    MATTE TIN OVER NICKEL

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    50 V

ERJPA2F1001X Frequently Asked Questions (FAQs)

  • The recommended land pattern for ERJPA2F1001X is a rectangular pad with a size of 1.3mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape.
  • To handle thermal considerations, ensure good thermal conduction by using a thermal pad or a heat sink, and avoid overheating by keeping the operating temperature within the recommended range of -55°C to 125°C.
  • The recommended soldering profile for ERJPA2F1001X is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C, and a cooling rate of 4°C/s or less.
  • Yes, ERJPA2F1001X is designed to withstand vibrations up to 10G, but it's recommended to follow the manufacturer's guidelines for vibration testing and to ensure proper mounting and fixation.
  • To ensure reliability in a humid environment, follow the manufacturer's guidelines for moisture sensitivity, and consider using a moisture-resistant coating or conformal coating to protect the component.

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ERJPA2F1001X Overview

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Part Image HPWR02FVEP1001NA Hitano Enterprise Corp

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