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ERJPA3F3301V - Panasonic

Description: Panasonic ERJPA3 Series Thick Film Surface Mount Resistor 0603 Case 3.3kΩ ±1% 0.25W ±100ppm/°C

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PCB Footprints
ERJPA3F3301V - Panasonic PCB footprint - Resistor Chip - Resistor Chip - ERJPA3(0603)
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3D Models
ERJPA3F3301V - Panasonic  - 3D model - Resistor Chip - ERJPA3(0603)
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ERJPA3F3301V Details

  • Manufacturer Part Number:

    ERJPA3F3301V

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan, Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Manufacturer:

    Panasonic Electronic Components

  • YTEOL:

    13

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.45 mm

  • Package Length:

    1.6 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    0.8 mm

  • Packing Method:

    TR, PUNCHED, 7 INCH

  • Rated Power Dissipation (P):

    0.25 W

  • Rated Temperature:

    105 °C

  • Reference Standard:

    AEC-Q200, IEC60115-8

  • Resistance:

    3300 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    0603

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    100 ppm/°C

  • Terminal Finish:

    MATTE TIN OVER NICKEL

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    150 V

ERJPA3F3301V Frequently Asked Questions (FAQs)

  • The recommended land pattern for ERJPA3F3301V can be found in the Panasonic Electronic Components' recommended land pattern document or in the IPC-7351 standard. It is essential to follow the recommended land pattern to ensure reliable soldering and to prevent defects.
  • ERJPA3F3301V has a maximum operating temperature of 125°C. While it can be used in high-temperature applications, it's essential to consider the derating of the component's characteristics and to ensure that the component does not exceed its maximum operating temperature.
  • ERJPA3F3301V should be stored in a dry, cool place, away from direct sunlight and moisture. During shipping, it's essential to use anti-static packaging and to follow the ESD handling precautions to prevent damage to the component.
  • ERJPA3F3301V has a moisture sensitivity level (MSL) of 2, which means it can be exposed to a humidity level of up to 60% at 30°C for 60 hours. However, it's essential to consider the component's reliability and to take necessary precautions to prevent moisture-related failures in high-humidity environments.
  • The recommended soldering profile for ERJPA3F3301V can be found in the Panasonic Electronic Components' soldering guidelines or in the IPC-J-STD-020 standard. It's essential to follow the recommended soldering profile to ensure reliable soldering and to prevent defects.

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ERJPA3F3301V Overview

Use the download button to access the ERJPA3F3301V schematic symbol, PCB footprint, and 3D model.
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