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ERJPA3F4021V - Panasonic

Description: PANASONIC - ERJPA3F4021V - SMD Chip Resistor, Anti-Surge, 0603 [1608 Metric], 4.02 kohm, ERJPA3 Series, 150 V, Thick Film

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PCB Footprints
ERJPA3F4021V - Panasonic PCB footprint - Resistor Chip - Resistor Chip - ERJPA3(0603)
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ERJPA3F4021V - Panasonic  - 3D model - Resistor Chip - ERJPA3(0603)
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ERJPA3F4021V Details

  • Manufacturer Part Number:

    ERJPA3F4021V

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan, Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Manufacturer:

    Panasonic Electronic Components

  • YTEOL:

    13

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.45 mm

  • Package Length:

    1.6 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    0.8 mm

  • Packing Method:

    TR, PUNCHED, 7 INCH

  • Rated Power Dissipation (P):

    0.25 W

  • Rated Temperature:

    105 °C

  • Reference Standard:

    AEC-Q200, IEC60115-8

  • Resistance:

    4020 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    0603

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    100 ppm/°C

  • Terminal Finish:

    MATTE TIN OVER NICKEL

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    150 V

ERJPA3F4021V Frequently Asked Questions (FAQs)

  • The recommended land pattern for ERJPA3F4021V is a rectangular pad with a size of 1.3mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask clearance of 0.1mm.
  • To handle thermal considerations for ERJPA3F4021V, ensure good thermal conduction by using a thermal pad or a heat sink, and keep the component away from heat sources. The maximum operating temperature is 125°C, and the thermal resistance (Rth) is 250°C/W.
  • The recommended soldering profile for ERJPA3F4021V is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C. The soldering process should be done in a nitrogen atmosphere to prevent oxidation.
  • Yes, ERJPA3F4021V is designed to withstand vibrations up to 10G (10Hz to 2000Hz). However, it's recommended to follow the recommended mounting and soldering procedures to ensure reliable operation in high-vibration environments.
  • To ensure the reliability of ERJPA3F4021V in humid environments, follow the recommended storage and handling procedures, and use a moisture-resistant coating or conformal coating on the PCB. The component is rated for 85°C/85% RH for 1000 hours.

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ERJPA3F4021V Overview

Use the download button to access the ERJPA3F4021V schematic symbol, PCB footprint, and 3D model.
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Part Image NRCPS06F4021TRQYF NIC Components Corp

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For a full list of alternate parts for ERJPA3F4021V, check out Findchips.com