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ERJS02J102X - Panasonic

Description: Anti-Sulfurated Thick Film Chip Resistor, 0402, 0.1W

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Symbol
ERJS02J102X - Panasonic - PCB symbol
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PCB Footprints
ERJS02J102X - Panasonic PCB footprint - Other - Other - ERJS02_U02_(0402)
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3D Models
ERJS02J102X - Panasonic - 3D model - Other - ERJS02_U02_(0402)
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ERJS02J102X Details

  • Manufacturer Part Number:

    ERJS02J102X

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    Panasonic Electronic Components

  • YTEOL:

    13

  • Additional Feature:

    ANTI-SULFUR

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.35 mm

  • Package Length:

    1 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    0.5 mm

  • Packing Method:

    TR, PUNCHED, 7 INCH

  • Rated Power Dissipation (P):

    0.1 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200, IEC60115-8

  • Resistance:

    1000 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    0402

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    200 ppm/°C

  • Terminal Finish:

    TIN

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    5%

  • Working Voltage:

    50 V

ERJS02J102X Frequently Asked Questions (FAQs)

  • The recommended land pattern for ERJS02J102X is a rectangular pad with a size of 1.5mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask clearance of 0.1mm.
  • To handle thermal considerations for ERJS02J102X, ensure that the component is placed on a thermally conductive substrate, and provide adequate thermal vias to dissipate heat. The recommended thermal resistance is ≤10°C/W.
  • The recommended soldering temperature profile for ERJS02J102X is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C. The soldering process should be done in a nitrogen atmosphere to prevent oxidation.
  • Yes, ERJS02J102X can be used in high-frequency applications up to 100 MHz. However, it's essential to consider the parasitic inductance and capacitance of the component and the PCB layout to ensure optimal performance.
  • To ensure the reliability of ERJS02J102X in harsh environments, follow the recommended storage and handling procedures, and ensure that the component is properly soldered and cleaned. Additionally, consider using conformal coating or potting to protect the component from moisture and contaminants.

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ERJS02J102X Overview

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Part Image RC0402JRG071K0L YAGEO Corporation

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