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ES3C - onsemi

Description: Easy pick and place. ; Superfast recovery times for highefficiency.; Low profile package. ; For surface mount applications. ; Glass passivated junction. ; Built-in strain relief.

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PCB Footprints
ES3C - onsemi PCB footprint - Diodes Moulded - Diodes Moulded - SMC CASE 403AG ISSUE O
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3D Models
ES3C - onsemi  - 3D model - Diodes Moulded - SMC CASE 403AG ISSUE O
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ES3C Details

  • Manufacturer Part Number:

    ES3C

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SMC

  • Package Description:

    SMC, 2 PIN

  • Manufacturer Package Code:

    403AG

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.22

  • Application:

    EFFICIENCY

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.95 V

  • JEDEC-95 Code:

    DO-214AB

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    100 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -50 °C

  • Output Current-Max:

    3 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    1.66 W

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    150 V

  • Reverse Current-Max:

    10 µA

  • Reverse Recovery Time-Max:

    35 µs

  • Reverse Test Voltage:

    0.95 V

  • Surface Mount:

    YES

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

ES3C Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the analog and digital sections separate, and use a common ground point for analog and digital grounds.
  • Use a metal shield around the ES3C, and ensure that the PCB layout is designed to minimize radiation. Also, use a common mode choke and a ferrite bead to filter out high-frequency noise.
  • The maximum operating temperature range for ES3C is -40°C to 125°C. However, the device may not function optimally at extreme temperatures, and thermal management is crucial for reliable operation.
  • Yes, ES3C is designed to withstand vibrations up to 10g. However, it's essential to ensure that the PCB is securely mounted and that the device is properly soldered to prevent mechanical stress.
  • Use a logic analyzer or an oscilloscope to debug the issue. Check the power supply, clock signals, and data lines for any anomalies. Also, consult the datasheet and application notes for troubleshooting guidelines.

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ES3C Overview

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Part Image ES3C-E3/9AT Vishay Intertechnologies

Rectifier Diode, 1 Phase, 1 Element, 3A, 150V V(RRM), Silicon, DO-214AB

Part Image ES3C-E3/57T Vishay Semiconductors

Rectifier Diode, 1 Phase, 1 Element, 3A, 150V V(RRM), Silicon, DO-214AB

Part Image U3C-E3/9AT Vishay Intertechnologies

Rectifier Diode, 1 Phase, 1 Element, 3A, 150V V(RRM), Silicon, DO-214AB

Part Image ES3CHE3/9AT Vishay Intertechnologies

Rectifier Diode, 1 Phase, 1 Element, 3A, 150V V(RRM), Silicon, DO-214AB

Part Image U3C-E3/9AT Vishay Semiconductors

DIODE 3 A, 150 V, SILICON, RECTIFIER DIODE, DO-214AB, ROHS COMPLIANT, PLASTIC, SMC, 2 PIN, Rectifier Diode

For a full list of alternate parts for ES3C, check out Findchips.com