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ES3DB-13-F - Diodes Incorporated

Description: Fast / Ultrafast Diode, 200 V, 3 A, Single, 900 mV, 25 ns, 100 A

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PCB Footprints
ES3DB-13-F - Diodes Incorporated PCB footprint - Diodes Moulded - Diodes Moulded - SMB
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ES3DB-13-F - Diodes Incorporated  - 3D model - Diodes Moulded - SMB
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ES3DB-13-F Details

  • Manufacturer Part Number:

    ES3DB-13-F

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    GREEN, PLASTIC, SMB, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    SMB

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    6

  • Application:

    EFFICIENCY

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.9 V

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    100 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    3 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    200 V

  • Reverse Recovery Time-Max:

    0.025 µs

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

ES3DB-13-F Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the ES3DB-13-F is a standard SOT23 package with a 1.5mm x 1.5mm pad size, with a 0.5mm keep-out area around the package.
  • To ensure proper soldering, use a soldering iron with a temperature of 250°C to 260°C, and apply a small amount of solder paste to the PCB pads. Use a soldering technique that minimizes the risk of overheating the device.
  • The maximum allowed voltage on the input pins of the ES3DB-13-F is 5.5V, exceeding which may cause damage to the device.
  • The ES3DB-13-F is rated for operation up to 125°C, but it's recommended to derate the device's performance at high temperatures. Consult the datasheet for specific derating guidelines.
  • Handle the ES3DB-13-F with ESD-protective equipment, such as wrist straps or mats, to prevent electrostatic discharge damage. Ground yourself before handling the device.

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ES3DB-13-F Overview

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