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ES3G - Diotec

Description: Rectifiers Diode, Superfast, SMC, 400V, 3A, 150C

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Symbol
ES3G - Diotec - PCB symbol
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PCB Footprints
ES3G - Diotec PCB footprint - Diodes Moulded - Diodes Moulded - SMC~DO-214AB.
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ES3G Details

  • Manufacturer Part Number:

    ES3G

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    ROHS COMPLIANT, PLASTIC, SMC, 2 PIN

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    Diotec Semiconductor AG

  • YTEOL:

    6.45

  • Application:

    SUPER FAST RECOVERY

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.3 V

  • JEDEC-95 Code:

    DO-214AB

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    125 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -50 °C

  • Output Current-Max:

    3 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Rep Pk Reverse Voltage-Max:

    400 V

  • Reverse Current-Max:

    5 µA

  • Reverse Recovery Time-Max:

    0.025 µs

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

ES3G Frequently Asked Questions (FAQs)

  • Diotec recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
  • Diotec recommends derating the maximum junction temperature (Tj) by 1°C per 1,000 feet of altitude above sea level. Additionally, ensure good thermal design, and consider using a heat sink or thermal interface material if necessary.
  • According to Diotec, ES3G can withstand surge currents up to 100A for 10ms, but this may vary depending on the specific application and operating conditions. It's recommended to consult with Diotec's application engineers for specific guidance.
  • Yes, ES3G can be used in parallel to increase current handling capability, but it's essential to ensure that the devices are properly matched and that the PCB layout is designed to minimize current imbalance and thermal differences between devices.
  • Diotec recommends storing ES3G in a dry, cool place with a relative humidity below 60% and a temperature range of -10°C to 30°C. It's also recommended to use a moisture barrier bag or desiccant to prevent moisture absorption.

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ES3G Overview

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For a full list of alternate parts for ES3G, check out Findchips.com