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ES3JBHR5G - Taiwan Semiconductor

Description: Rectifiers 3A, 600V, SUPER FAST SMT RECTIFIER

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PCB Footprints
ES3JBHR5G - Taiwan Semiconductor PCB footprint - Diodes Moulded - Diodes Moulded - DO-214AA (SMB)
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3D Models
ES3JBHR5G - Taiwan Semiconductor  - 3D model - Diodes Moulded - DO-214AA (SMB)
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ES3JBHR5G Details

  • Manufacturer Part Number:

    ES3JBHR5G

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    SMB, 2 PIN

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    Taiwan Semiconductor

  • YTEOL:

    0

  • Application:

    EFFICIENCY

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.45 V

  • JEDEC-95 Code:

    DO-214AA

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    100 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    3 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Reference Standard:

    AEC-Q101

  • Rep Pk Reverse Voltage-Max:

    600 V

  • Reverse Current-Max:

    10 µA

  • Reverse Recovery Time-Max:

    0.035 µs

  • Surface Mount:

    YES

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

ES3JBHR5G Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves placing thermal vias under the package, using a solid ground plane, and keeping the thermal traces as short and wide as possible. A 4-layer PCB with a dedicated thermal layer is also recommended.
  • To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions, use a suitable thermal interface material, and implement a robust thermal management system. Additionally, consider using a heat sink or a fan to keep the junction temperature below 125°C.
  • The built-in ESD protection in the ES3JBHR5G is designed to protect against electrostatic discharge up to 2 kV according to the Human Body Model (HBM). However, it's not designed to protect against other types of ESD events, such as Charged Device Model (CDM) or Machine Model (MM). Additional external ESD protection may be necessary depending on the application.
  • While the ES3JBHR5G is a high-quality device, it's essential to consult with Taiwan Semiconductor's sales team or a qualified representative to determine its suitability for high-reliability or automotive applications. Additional testing, qualification, and documentation may be required to meet the specific requirements of these industries.
  • To troubleshoot issues related to the internal voltage regulator, start by verifying the input voltage and current, as well as the output voltage and current. Check for any signs of overheating, and ensure that the device is properly soldered and mounted. If the issue persists, consult the datasheet and application notes, or contact Taiwan Semiconductor's technical support team for further assistance.

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