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ESD122DMYR - Texas Instruments

Description: 2-Channel ESD Protection Diode for USB Type-C and HDMI 2.0

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PCB Footprints
ESD122DMYR - Texas Instruments PCB footprint - Other - Other - DMY0003A
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ESD122DMYR - Texas Instruments  - 3D model - Other - DMY0003A
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ESD122DMYR Details

  • Manufacturer Part Number:

    ESD122DMYR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Date Of Intro:

    2017-06-11

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Breakdown Voltage-Max:

    7.9 V

  • Breakdown Voltage-Min:

    5 V

  • Breakdown Voltage-Nom:

    6.45 V

  • Clamping Voltage-Max:

    13.5 V

  • Configuration:

    COMMON ANODE, 2 ELEMENTS, 2 CHANNEL

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JESD-30 Code:

    R-PBCC-N3

  • JESD-609 Code:

    e4

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    20 W

  • Number of Elements:

    2

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    BIDIRECTIONAL

  • Reference Standard:

    IEC-61000-4-2, 4-4, 4-5

  • Rep Pk Reverse Voltage-Max:

    3.6 V

  • Reverse Current-Max:

    0.01 µA

  • Reverse Test Voltage:

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

ESD122DMYR Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal ESD protection involves placing the ESD122DMYR close to the connector or interface it is protecting, using short traces, and minimizing the distance between the device and the protected circuit. Additionally, a solid ground plane and a low-impedance path to ground can help to dissipate ESD energy.
  • To choose the correct ESD protection device, consider the following factors: the type and level of ESD protection required, the operating voltage and frequency of the circuit, the available board space and layout constraints, and the desired level of protection (e.g., IEC 61000-4-2, ISO 10605, or other standards).
  • The ESD122DMYR is a specific device with a unique set of characteristics, such as its low capacitance and high surge capability. Compared to other TI ESD protection devices, the ESD122DMYR may have different parameters such as capacitance, leakage current, or response time. Consult the datasheet and application notes to determine the best device for your specific application.
  • To ensure proper soldering and assembly, follow the recommended soldering profile and handling procedures outlined in the datasheet and application notes. Use a soldering iron with a temperature-controlled tip, and avoid applying excessive heat or mechanical stress to the device.
  • Common mistakes to avoid when using the ESD122DMYR include: incorrect PCB layout, inadequate grounding, and insufficient clearance from other components. Additionally, avoid over-soldering or applying excessive heat, which can damage the device or compromise its performance.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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