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ESD12VD9-TP - MCC

Description: 18.4V Clamp 1A (8/20µs) Ipp Tvs Diode Surface Mount SOD-923

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ESD12VD9-TP - MCC - PCB symbol
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PCB Footprints
ESD12VD9-TP - MCC PCB footprint - Other - Other - ESD12VD9-TP-4
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3D Models
ESD12VD9-TP - MCC - 3D model - Other - ESD12VD9-TP-4
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ESD12VD9-TP Details

  • Manufacturer Part Number:

    ESD12VD9-TP

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    PACKAGE-2

  • Pin Count:

    2

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    6

  • Breakdown Voltage-Min:

    13.5 V

  • Clamping Voltage-Max:

    18.4 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    100 W

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Rep Pk Reverse Voltage-Max:

    12 V

  • Reverse Current-Max:

    1 µA

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

ESD12VD9-TP Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for ESD12VD9-TP is a rectangular pad with dimensions of 1.5mm x 0.8mm, with a 0.5mm diameter hole in the center for the device's lead.
  • To ensure reliable soldering of ESD12VD9-TP, use a soldering iron with a temperature of 250°C to 270°C, and apply a small amount of solder paste to the PCB pad. Avoid applying excessive heat or pressure, which can damage the device.
  • Yes, ESD12VD9-TP is suitable for high-frequency applications up to 1 GHz. However, it's essential to consider the device's parasitic capacitance and inductance when designing the PCB layout.
  • ESD12VD9-TP protects against ESD by using a combination of diodes and resistors to clamp the voltage and absorb the energy of the ESD event, preventing damage to the protected circuit.
  • Yes, ESD12VD9-TP is compatible with automotive applications and meets the requirements of IEC 61000-4-2 for electrostatic discharge protection.

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ESD12VD9-TP Overview

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