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ESD3V3D9-TP - MCC

Description: ESD Protection Devices

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Symbol
ESD3V3D9-TP - MCC - PCB symbol
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PCB Footprints
ESD3V3D9-TP - MCC PCB footprint - Small Outline Diode Flat Lead - Small Outline Diode Flat Lead - SOD-923
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3D Models
ESD3V3D9-TP - MCC - 3D model - Small Outline Diode Flat Lead - SOD-923
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ESD3V3D9-TP Details

  • Manufacturer Part Number:

    ESD3V3D9-TP

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    PACKAGE-2

  • Pin Count:

    2

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    5.95

  • Breakdown Voltage-Min:

    5 V

  • Clamping Voltage-Max:

    8.8 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    100 W

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Rep Pk Reverse Voltage-Max:

    3.3 V

  • Reverse Current-Max:

    1 µA

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

ESD3V3D9-TP Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for ESD3V3D9-TP is a 0402 package with a pad size of 0.5mm x 0.3mm. It's essential to follow the recommended footprint to ensure proper soldering and to prevent thermal issues.
  • To ensure proper soldering, use a soldering iron with a temperature of 250°C to 260°C. Apply a small amount of solder paste to the PCB pads, and then place the ESD3V3D9-TP on the pads. Use a reflow oven or a hot air gun to melt the solder paste. Make sure to follow the recommended soldering profile to prevent damage to the component.
  • The maximum operating temperature for ESD3V3D9-TP is 125°C. Exceeding this temperature may cause the component to malfunction or reduce its lifespan.
  • Yes, ESD3V3D9-TP is suitable for high-frequency applications up to 1 GHz. However, it's essential to consider the component's parasitic inductance and capacitance when designing the PCB layout to minimize signal degradation.
  • To prevent damage, store ESD3V3D9-TP in its original packaging or in a dry, cool place. Avoid exposing the component to moisture, extreme temperatures, or physical stress during shipping and storage.

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ESD3V3D9-TP Overview

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