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ESD5004MXTBG - onsemi

Description: Low Capacitance (5pF Typ, I/O to GND); Four Separate Bi-directional Configurations for Protection; Low ESD Clamping Voltage

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ESD5004MXTBG - onsemi - PCB symbol
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ESD5004MXTBG - onsemi PCB footprint - Other - Other - ESD5004MXTBG-2
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ESD5004MXTBG - onsemi - 3D model - Other - ESD5004MXTBG-2
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ESD5004MXTBG Details

  • Manufacturer Part Number:

    ESD5004MXTBG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    X3DFN-4

  • Package Description:

    X3DFN4, 5 PIN

  • Manufacturer Package Code:

    714AA

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Additional Feature:

    LOW CAPACITANCE

  • Breakdown Voltage-Min:

    3.9 V

  • Case Connection:

    ANODE

  • Clamping Voltage-Max:

    9.1 V

  • Configuration:

    COMMON ANODE, 4 ELEMENTS, 4 CHANNEL

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JESD-30 Code:

    R-PBCC-N5

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    4

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    BIDIRECTIONAL

  • Reference Standard:

    IEC-61000-4-2

  • Rep Pk Reverse Voltage-Max:

    3.3 V

  • Reverse Current-Max:

    1 µA

  • Reverse Test Voltage:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    NICKEL GOLD PALLADIUM

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

ESD5004MXTBG Frequently Asked Questions (FAQs)

  • A good PCB layout for the ESD5004MXTBG involves keeping the device close to the connector, using a ground plane, and minimizing the length of the signal traces. It's also recommended to use a common ground point for the device and the connector.
  • To ensure proper soldering, use a soldering iron with a temperature of 250°C to 260°C, and apply a small amount of solder paste to the pads. Use a soldering technique that minimizes the risk of overheating the device.
  • The ESD5004MXTBG has an operating temperature range of -40°C to 125°C. However, it's recommended to operate the device within a temperature range of 0°C to 85°C for optimal performance and reliability.
  • Yes, the ESD5004MXTBG is suitable for high-frequency applications up to 6 GHz. However, it's essential to follow proper PCB layout and design guidelines to minimize signal attenuation and ensure optimal performance.
  • To prevent damage, store the ESD5004MXTBG in its original packaging or an anti-static bag. Avoid exposing the device to moisture, extreme temperatures, or physical stress during shipping and storage.

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ESD5004MXTBG Overview

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