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ESD5101FCT5G - onsemi

Description: Low Capacitance (5.5 pF Max, I/O to GND); Small Body Outline Dimensions 01005 Size: 0.435 x 0.23 mm; Protection for the Following IEC Standards: IEC 61000−4−2 (Level 4); Low ESD Clamping Voltage; These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant

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ESD5101FCT5G - onsemi PCB footprint - Other - Other - ESD5101FCT5G-11
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ESD5101FCT5G - onsemi  - 3D model - Other - ESD5101FCT5G-11
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ESD5101FCT5G Details

  • Manufacturer Part Number:

    ESD5101FCT5G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DSN-2

  • Package Description:

    0.435 X 0.23 MM, HALOGEN FREE AND ROHS COMPLIANT, 152AK, 01005, DSN2, 2 PIN

  • Manufacturer Package Code:

    152AK

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    7

  • Additional Feature:

    EXCELLENT CLAMPING CAPABILITY, LOW CAPACITANCE

  • Breakdown Voltage-Max:

    6.5 V

  • Breakdown Voltage-Min:

    3.68 V

  • Breakdown Voltage-Nom:

    5 V

  • Clamping Voltage-Max:

    6.5 V

  • Configuration:

    SINGLE, 1 CHANNEL

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JESD-30 Code:

    R-XBCC-N2

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    BIDIRECTIONAL

  • Reference Standard:

    IEC-61000-4-2

  • Rep Pk Reverse Voltage-Max:

    3.3 V

  • Reverse Current-Max:

    0.1 µA

  • Reverse Test Voltage:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

ESD5101FCT5G Frequently Asked Questions (FAQs)

  • A good PCB layout for ESD5101FCT5G involves placing the device close to the connector or interface, using short traces, and minimizing the distance between the device and the protected line. A ground plane under the device is also recommended.
  • To choose the correct ESD protection device, consider the interface type (e.g., USB, HDMI, Ethernet), the voltage and current requirements, and the level of ESD protection needed (e.g., IEC 61000-4-2). Consult the datasheet and application notes for guidance.
  • The maximum operating temperature for the ESD5101FCT5G is 125°C, as specified in the datasheet. Operating the device above this temperature may affect its performance and reliability.
  • Yes, the ESD5101FCT5G is suitable for automotive applications, as it meets the requirements of ISO 7637-3 and IEC 61000-4-2. However, ensure that the device is properly qualified and validated for the specific automotive application.
  • Follow the recommended soldering and assembly guidelines in the datasheet and application notes. Ensure proper soldering techniques, and avoid overheating or applying excessive force during assembly.

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