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ESD5581MXT5G - onsemi

Description: Low Capacitance, 5.0 µF (Max); Low Clamping Voltage, 10 V; Small Body Outline Dimensions, 0.62 mm x 0.32 mm; Low Body Height, 0.3 mm; Stand−off Voltage, 5 V; IEC61000−4−2, Level 4 ESD Protection

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ESD5581MXT5G - onsemi PCB footprint - Other - Other - ESD5581MXT5G-1
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ESD5581MXT5G - onsemi  - 3D model - Other - ESD5581MXT5G-1
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ESD5581MXT5G Details

  • Manufacturer Part Number:

    ESD5581MXT5G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    X3DFN-2

  • Manufacturer Package Code:

    152AF

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Additional Feature:

    EXCELLENT CLAMPING CAPABILITY

  • Breakdown Voltage-Max:

    7.5 V

  • Breakdown Voltage-Min:

    5.2 V

  • Breakdown Voltage-Nom:

    6.2 V

  • Clamping Voltage-Max:

    12 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JESD-30 Code:

    R-PBCC-N2

  • JESD-609 Code:

    e4

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    BIDIRECTIONAL

  • Power Dissipation-Max:

    0.25 W

  • Reference Standard:

    IEC-61000-4-2

  • Rep Pk Reverse Voltage-Max:

    5 V

  • Reverse Current-Max:

    0.1 µA

  • Reverse Test Voltage:

    5 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    NICKEL PALLADIUM GOLD

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

ESD5581MXT5G Frequently Asked Questions (FAQs)

  • A good PCB layout for ESD5581MXT5G involves keeping the device close to the connector, using a ground plane, and minimizing the length of the signal traces. It's also recommended to use a common ground point for the device and the connector.
  • The ESD5581MXT5G requires a 5V power supply, and it's recommended to use a low-ESR capacitor (e.g., 10uF) close to the device to filter out noise and ensure stable operation.
  • The ESD5581MXT5G supports cable lengths up to 3 meters (10 feet) for USB 2.0 and 1 meter (3.3 feet) for USB 3.2 Gen 1, assuming a good quality cable with proper shielding and termination.
  • The ESD5581MXT5G is rated for operation up to 85°C (185°F), but it's recommended to derate the device's performance at higher temperatures. Consult the datasheet for specific derating guidelines.
  • To troubleshoot ESD5581MXT5G-related issues, check the power supply, signal integrity, and PCB layout. Use oscilloscopes or logic analyzers to verify signal quality and timing. Consult the datasheet and application notes for specific troubleshooting guidelines.

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ESD5581MXT5G Overview

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