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ESD562DBZR - Texas Instruments

Description: 21V Clamp 3.5A (8/20µs) Ipp Tvs Diode Surface Mount SOT-23-3

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PCB Footprints
ESD562DBZR - Texas Instruments PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - DBZ0003A_2025
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3D Models
ESD562DBZR - Texas Instruments  - 3D model - SOT23 (3-Pin) - DBZ0003A_2025
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ESD562DBZR Details

  • Manufacturer Part Number:

    ESD562DBZR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Breakdown Voltage-Max:

    18 V

  • Breakdown Voltage-Min:

    14 V

  • Breakdown Voltage-Nom:

    15.6 V

  • Clamping Voltage-Max:

    21 V

  • Configuration:

    COMMON ANODE, 2 ELEMENTS, 2 CHANNEL

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JEDEC-95 Code:

    TO-236

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e4

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    75 W

  • Number of Elements:

    2

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    BIDIRECTIONAL

  • Reference Standard:

    IEC-61000-4-2, 4-5

  • Rep Pk Reverse Voltage-Max:

    12 V

  • Reverse Current-Max:

    0.05 µA

  • Reverse Test Voltage:

    12 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

ESD562DBZR Frequently Asked Questions (FAQs)

  • Texas Instruments recommends a layout with the ESD device placed as close as possible to the connector or interface, and with a direct path to the ground plane. A minimum of 4 vias to the ground plane is recommended for optimal performance.
  • The ESD562DBZR is designed to handle surge pulses according to the IEC 61000-4-5 standard. It can withstand surge pulses up to 4A (8/20μs) and 2A (10/700μs) without damage or degradation.
  • The maximum operating temperature for the ESD562DBZR is 125°C. Operating the device above this temperature may affect its performance and reliability.
  • Yes, the ESD562DBZR is AEC-Q101 qualified, making it suitable for use in automotive applications. However, it's essential to ensure that the device is met, and the device is used within its specified operating conditions.
  • The ESD562DBZR is designed to minimize the impact on signal integrity. It has a low capacitance of 0.5pF and a low inductance of 0.5nH, making it suitable for high-speed interfaces such as USB, HDMI, and PCIe.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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