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ESD5Z12T1G - onsemi

Description: Low Clamping Voltage; Small Body Outline Dimensions: 0.047″ x 0.032″ (1.20 mm x 0.80 mm); Low Leakage; Response Time is Typically < 1 ns; IEC61000−4−2 Level 4 ESD Protection and IEC61000−4−4 Level 4 EFT Protection; SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable; Peak Power up to 240 Watts @ 8 x 20 s Pulse; Low Body Height: 0.028″ (0.7 mm); ESD Rating of Class 3 (> 16 kV) per Human Body Model; These Devices are Pb−Fre

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PCB Footprints
ESD5Z12T1G - onsemi PCB footprint - Small Outline Diode Flat Lead - Small Outline Diode Flat Lead - SOD-523 CASE 502
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3D Models
ESD5Z12T1G - onsemi  - 3D model - Small Outline Diode Flat Lead - SOD-523 CASE 502
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ESD5Z12T1G Details

  • Manufacturer Part Number:

    ESD5Z12T1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOD-523 2 LEAD

  • Package Description:

    SOD-523, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    502

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    onsemi

  • YTEOL:

    6.28

  • Additional Feature:

    EXCELLENT CLAMPING CAPABILITY

  • Breakdown Voltage-Min:

    14.1 V

  • Clamping Voltage-Max:

    25 V

  • Configuration:

    SINGLE, 1 CHANNEL

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • Forward Voltage-Max (VF):

    1.1 V

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    240 W

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.2 W

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    IEC-61000-4-2, 4-4

  • Rep Pk Reverse Voltage-Max:

    12 V

  • Reverse Current-Max:

    0.01 µA

  • Reverse Test Voltage:

    12 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

ESD5Z12T1G Frequently Asked Questions (FAQs)

  • A good PCB layout for the ESD5Z12T1G involves keeping the device close to the connector, using a ground plane, and minimizing the length of the signal traces. It's also recommended to use a common ground point for the device and the connector.
  • To ensure proper soldering, use a soldering iron with a temperature of 250°C to 260°C, and apply a small amount of solder paste to the pads. Use a soldering technique that minimizes the risk of overheating the device.
  • The ESD5Z12T1G can operate safely within a temperature range of -40°C to 125°C. However, it's recommended to operate the device within a temperature range of 0°C to 85°C for optimal performance.
  • Yes, the ESD5Z12T1G is suitable for high-frequency applications up to 1 GHz. However, it's essential to follow proper PCB layout and design guidelines to minimize signal attenuation and ensure optimal performance.
  • Handle the ESD5Z12T1G with care to prevent mechanical damage. Store the devices in their original packaging, away from direct sunlight and moisture. Avoid bending or flexing the leads, and use anti-static packaging materials to prevent ESD damage.

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ESD5Z12T1G Overview

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