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ESD5Z7.0T1G - onsemi

Description: Low Clamping Voltage; Small Body Outline Dimensions: 0.047″ x 0.032″ (1.20 mm x 0.80 mm); Low Leakage; Response Time is Typically < 1 ns; IEC61000−4−2 Level 4 ESD Protection and IEC61000−4−4 Level 4 EFT Protection; SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable; Peak Power up to 240 Watts @ 8 x 20 s Pulse; Low Body Height: 0.028″ (0.7 mm); ESD Rating of Class 3 (> 16 kV) per Human Body Model; These Devices are Pb−Fre

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PCB Footprints
ESD5Z7.0T1G - onsemi PCB footprint - Small Outline Diode Flat Lead - Small Outline Diode Flat Lead - MM5Z11VT5G
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ESD5Z7.0T1G - onsemi  - 3D model - Small Outline Diode Flat Lead - MM5Z11VT5G
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ESD5Z7.0T1G Details

  • Manufacturer Part Number:

    ESD5Z7.0T1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOD-523 2 LEAD

  • Package Description:

    SOD-523, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    502

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    onsemi

  • YTEOL:

    6.28

  • Additional Feature:

    EXCELLENT CLAMPING CAPABILITY

  • Breakdown Voltage-Min:

    7.5 V

  • Clamping Voltage-Max:

    22.7 V

  • Configuration:

    SINGLE, 1 CHANNEL

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • Forward Voltage-Max (VF):

    1.1 V

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    200 W

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.2 W

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    IEC-61000-4-2, 4-4

  • Rep Pk Reverse Voltage-Max:

    7 V

  • Reverse Current-Max:

    0.01 µA

  • Reverse Test Voltage:

    7 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

ESD5Z7.0T1G Frequently Asked Questions (FAQs)

  • A good PCB layout for ESD5Z7.0T1G involves keeping the device close to the protected line, using short traces, and minimizing the distance between the device and the connector. A ground plane under the device can also help reduce noise and improve performance.
  • The recommended capacitor value for ESD5Z7.0T1G is 1nF to 10nF. The capacitor value should be chosen based on the specific application requirements, such as the frequency of operation and the desired level of protection.
  • The maximum operating temperature for ESD5Z7.0T1G is 125°C. However, it's recommended to operate the device within a temperature range of -40°C to 85°C for optimal performance and reliability.
  • Yes, ESD5Z7.0T1G is suitable for high-speed data lines, such as USB, HDMI, and Ethernet. The device has a low capacitance of 0.5pF, which minimizes signal distortion and ensures high-speed signal integrity.
  • To ensure proper soldering, follow the recommended soldering profile and use a solder with a melting point below 260°C. Apply a small amount of solder paste to the PCB pads and use a reflow oven or a hot air gun to solder the device.

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ESD5Z7.0T1G Overview

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