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ESD7381MUT5G - onsemi

Description: UltraLow Capacitance: 0.37 pF; Insertion Loss: 0.030 dBm; Low Dynamic Resistance < 1Ω; IEC6100042 Level 4 ESD Protection

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Symbol
ESD7381MUT5G - onsemi - PCB symbol
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PCB Footprints
ESD7381MUT5G - onsemi PCB footprint - Other - Other - X3DFN2,0.62x0.32, 0.355P, (0201)
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3D Models
ESD7381MUT5G - onsemi - 3D model - Other - X3DFN2,0.62x0.32, 0.355P, (0201)
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ESD7381MUT5G Details

  • Manufacturer Part Number:

    ESD7381MUT5G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    X3DFN2, 0.62x0.32, 0.355P, (0201)

  • Package Description:

    X3DFN2, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    152AF

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    onsemi

  • YTEOL:

    7

  • Breakdown Voltage-Min:

    5 V

  • Clamping Voltage-Max:

    10 V

  • Configuration:

    SINGLE, 1 CHANNEL

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JESD-30 Code:

    R-PBCC-N2

  • JESD-609 Code:

    e4

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.25 W

  • Reference Standard:

    IEC-61000-4-2

  • Rep Pk Reverse Voltage-Max:

    3.3 V

  • Reverse Current-Max:

    0.05 µA

  • Reverse Test Voltage:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

ESD7381MUT5G Frequently Asked Questions (FAQs)

  • A good PCB layout for ESD7381MUT5G involves keeping the device close to the protected line, using short traces, and minimizing the distance between the device and the connector. A ground plane under the device is also recommended to reduce noise and improve performance.
  • The recommended capacitor value for ESD7381MUT5G is 0.1uF to 1uF, with a voltage rating of 6.3V or higher. The capacitor value should be chosen based on the specific application requirements, such as the frequency of operation and the desired level of filtering.
  • The maximum operating temperature range for ESD7381MUT5G is -40°C to 125°C. However, it's recommended to operate the device within a temperature range of -20°C to 85°C for optimal performance and reliability.
  • Yes, ESD7381MUT5G is suitable for high-speed data line applications, such as USB, HDMI, and Ethernet. The device is designed to provide high-speed signal integrity and ESD protection up to 15kV.
  • To ensure proper soldering of ESD7381MUT5G, follow the recommended soldering profile and use a solder with a melting point of 220°C or higher. Apply a small amount of solder paste to the PCB pads and use a reflow oven or hot air gun to solder the device.

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ESD7381MUT5G Overview

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