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ESD7424MUT5G - onsemi

Description: IEC 61000-4-2 (ESD) Level 4 +/-30kV Contact; ISO 10605 (ESD) 330pF/330Ω +/-30kV Contact; Industry Leading Capacitance Linearity Over Voltage; Ultra-Low Capacitance < 1.0pF Max; Low Leakage < 1uA

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ESD7424MUT5G - onsemi PCB footprint - Other - Other - ESD7424MUT5G-1
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ESD7424MUT5G - onsemi  - 3D model - Other - ESD7424MUT5G-1
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ESD7424MUT5G Details

  • Manufacturer Part Number:

    ESD7424MUT5G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    UDFN-2

  • Package Description:

    UDFN-2

  • Manufacturer Package Code:

    517CZ

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Breakdown Voltage-Min:

    30 V

  • Breakdown Voltage-Nom:

    26 V

  • Clamping Voltage-Max:

    45 V

  • Configuration:

    SINGLE, 1 CHANNEL

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JESD-30 Code:

    R-PBCC-N2

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Polarity:

    BIDIRECTIONAL

  • Power Dissipation-Max:

    0.3 W

  • Reference Standard:

    IEC-61000-4-2, 4-4, 4-5

  • Rep Pk Reverse Voltage-Max:

    24 V

  • Reverse Current-Max:

    1 µA

  • Reverse Test Voltage:

    24 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Nickel/Gold/Palladium (Ni/Au/Pd)

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

ESD7424MUT5G Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal ESD protection involves placing the ESD7424MUT5G close to the connector or interface, using short traces, and minimizing the distance between the device and the protected lines. Additionally, a solid ground plane and a low-impedance path to ground can help to reduce the impedance of the discharge path.
  • To choose the right ESD protection device, consider the following factors: the type and level of ESD protection required, the operating voltage and frequency of the system, the type of interface or connector being protected, and the available board space and layout constraints. The ESD7424MUT5G is suitable for high-speed interfaces such as USB, HDMI, and DisplayPort.
  • The ESD7424MUT5G is a high-performance ESD protection device with a low capacitance of 0.4pF and a high surge current rating of 20A. It is designed for high-speed interfaces and has a low clamping voltage of 6V. Other ESD protection devices from onsemi may have different capacitance, surge current, and clamping voltage characteristics, making them more or less suitable for specific applications.
  • To ensure proper soldering and assembly, follow the recommended soldering profile and handling procedures outlined in the onsemi datasheet and application notes. Use a soldering iron with a temperature of 260°C to 280°C, and avoid applying excessive force or pressure to the device during assembly.
  • The ESD7424MUT5G is manufactured by onsemi, a reputable semiconductor company, and meets industry-standard reliability and quality standards such as AEC-Q101 and IEC 61000-4-2. The device is also RoHS and REACH compliant.

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ESD7424MUT5G Overview

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