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ESD8351XV2T1G - onsemi

Description: Low Capacitance (0.55 pF Max, I/O to GND); SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable; Low ESD Clamping Voltage; Protection for the Following IEC Standards: IEC 61000−4−2 (Level 4) ISO 10605; These Devices are PbFree, Halogen Free/BFR Free and are RoHS Compliant

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ESD8351XV2T1G - onsemi - PCB symbol
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PCB Footprints
ESD8351XV2T1G - onsemi PCB footprint - Small Outline Diode Flat Lead - Small Outline Diode Flat Lead - SOD-523 CASE 502
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3D Models
ESD8351XV2T1G - onsemi - 3D model - Small Outline Diode Flat Lead - SOD-523 CASE 502
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ESD8351XV2T1G Details

  • Manufacturer Part Number:

    ESD8351XV2T1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOD-523 2 LEAD

  • Pin Count:

    2

  • Manufacturer Package Code:

    502

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.44

  • Additional Feature:

    ULTRA LOW CAPACITANCE

  • Breakdown Voltage-Max:

    7.8 V

  • Breakdown Voltage-Min:

    5.5 V

  • Breakdown Voltage-Nom:

    7 V

  • Clamping Voltage-Max:

    11.2 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Reference Standard:

    IEC-61000-4-2

  • Rep Pk Reverse Voltage-Max:

    3.3 V

  • Reverse Current-Max:

    0.5 µA

  • Reverse Test Voltage:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

ESD8351XV2T1G Frequently Asked Questions (FAQs)

  • A good PCB layout for ESD8351XV2T1G involves keeping the device close to the protected line, using short traces, and minimizing the distance between the device and the connector. A ground plane under the device is also recommended to reduce noise and improve performance.
  • The recommended capacitor value for ESD8351XV2T1G is 1nF to 10nF. The capacitor value should be chosen based on the specific application requirements, such as the frequency of operation and the desired level of ESD protection.
  • The maximum operating temperature range for ESD8351XV2T1G is -40°C to 125°C. However, it's recommended to operate the device within a temperature range of -20°C to 85°C for optimal performance and reliability.
  • Yes, ESD8351XV2T1G is suitable for high-speed data lines, such as USB, HDMI, and Ethernet. The device is designed to provide ESD protection while minimizing signal distortion and attenuation.
  • To ensure proper soldering of ESD8351XV2T1G, follow the recommended soldering profile and use a solder with a melting point below 260°C. Avoid applying excessive heat or force during soldering, and ensure the device is properly aligned with the PCB pads.

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ESD8351XV2T1G Overview

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