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ESDA25B1 - STMicroelectronics

Description: TVS Diode Array Bi-Directional ESDA25B1 Array, 150W, SO-8 8-Pin

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ESDA25B1 - STMicroelectronics - PCB symbol
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ESDA25B1 - STMicroelectronics PCB footprint - Small Outline Packages - Small Outline Packages - SO-8 height 1.75
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ESDA25B1 - STMicroelectronics - 3D model - Small Outline Packages - SO-8 height 1.75
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ESDA25B1 Details

  • Manufacturer Part Number:

    ESDA25B1

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOD

  • Package Description:

    PLASTIC, SOP-8

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    0

  • Breakdown Voltage-Max:

    30 V

  • Breakdown Voltage-Min:

    25 V

  • Breakdown Voltage-Nom:

    27.5 V

  • Configuration:

    COMPLEX, 6 CHANNEL

  • Diode Capacitance-Min:

    15 pF

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    150 W

  • Number of Elements:

    8

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    BIDIRECTIONAL

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    IEC-1000-4-2, MIL-STD-883C

  • Rep Pk Reverse Voltage-Max:

    24 V

  • Reverse Current-Max:

    2 µA

  • Reverse Test Voltage:

    24 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

ESDA25B1 Frequently Asked Questions (FAQs)

  • A good PCB layout for ESDA25B1 should have a short and direct connection to the protected line, with a ground plane nearby to dissipate the ESD energy. The device should be placed close to the connector or interface to be protected.
  • The choice of package type (SOT23, SOT323, or μQFN) depends on the available PCB space, thermal considerations, and the desired level of ESD protection. SOT23 is a good all-around choice, while SOT323 is more compact and μQFN offers better thermal performance.
  • The maximum operating voltage for ESDA25B1 is 5.5V, but it can withstand up to 12V for a short duration (e.g., during an ESD event). Operating the device above 5.5V may reduce its lifespan.
  • Yes, ESDA25B1 is suitable for protecting high-speed interfaces like USB or HDMI. Its low capacitance (0.4pF) and high bandwidth (>1GHz) make it an ideal choice for these applications.
  • To ensure proper soldering, follow the recommended soldering profile, use a solder with a melting point below 260°C, and avoid applying excessive heat or force to the device. Inspect the solder joints for any defects or cold solder joints.

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ESDA25B1 Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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