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ESDALC6V1M3 - STMicroelectronics

Description: Dual low capacitance Transil™ array for ESD protection 11pF @ 1MHz , 5V , 30W , -40°C ~ 125°C (TJ)

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ESDALC6V1M3 - STMicroelectronics PCB footprint - Other - Other - SOT883
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ESDALC6V1M3 - STMicroelectronics  - 3D model - Other - SOT883
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ESDALC6V1M3 Details

  • Manufacturer Part Number:

    ESDALC6V1M3

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • Package Description:

    ROHS COMPLIANT, PLASTIC, SOT-883, 3 PIN

  • Pin Count:

    236

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    0

  • Additional Feature:

    LOW LEAKAGE CURRENT

  • Breakdown Voltage-Max:

    7.2 V

  • Breakdown Voltage-Min:

    6.1 V

  • Breakdown Voltage-Nom:

    6.65 V

  • Case Connection:

    CATHODE

  • Configuration:

    COMMON ANODE, 2 ELEMENTS, 2 CHANNEL

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JEDEC-95 Code:

    MO-236AA

  • JESD-30 Code:

    R-PBCC-N3

  • JESD-609 Code:

    e4

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    30 W

  • Number of Elements:

    2

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    IEC-61000-4-2; MIL-STD-883G

  • Rep Pk Reverse Voltage-Max:

    5 V

  • Reverse Current-Max:

    0.5 µA

  • Reverse Test Voltage:

    5 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

ESDALC6V1M3 Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal ESD protection involves placing the ESDALC6V1M3 close to the connector or interface it is protecting, and using a ground plane to dissipate the ESD energy. The device should also be connected to a low-impedance ground path to ensure effective discharge of ESD pulses.
  • To choose the right ESD protection device, consider the interface or connector type, the data rate, and the level of protection required. The ESDALC6V1M3 is suitable for high-speed interfaces such as USB, HDMI, and Ethernet. Ensure the device can handle the maximum voltage and current of your application.
  • The ESDALC6V1M3 has an operating temperature range of -40°C to 150°C, making it suitable for use in a wide range of applications, from consumer electronics to industrial and automotive systems.
  • The ESDALC6V1M3 is designed to withstand multiple ESD strikes without degradation or failure. The device can absorb and dissipate multiple ESD pulses, ensuring continued protection of the downstream circuitry.
  • While the ESDALC6V1M3 is primarily designed for ESD protection, it also provides some level of EMI filtering due to its internal capacitance. However, it is not a substitute for a dedicated EMI filter, and additional filtering components may still be required to meet EMI standards.

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ESDALC6V1M3 Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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