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ESDAULC6-3BP6 - STMicroelectronics

Description: STMicroelectronics ESDAULC6-3BP6, Triple-Element Bi-Directional ESD Protection Array, 6-Pin SOT-666

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ESDAULC6-3BP6 - STMicroelectronics PCB footprint - Other - Other - ESDAULC6-3BP6-2
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ESDAULC6-3BP6 - STMicroelectronics  - 3D model - Other - ESDAULC6-3BP6-2
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ESDAULC6-3BP6 Details

  • Manufacturer Part Number:

    ESDAULC6-3BP6

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    ROHS COMPLIANT, PLASTIC PACKAGE-6

  • Pin Count:

    6

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    6.2

  • Additional Feature:

    HIGH RELIABILITY, ULTRA LOW CAPACITANCE

  • Breakdown Voltage-Max:

    9.2 V

  • Breakdown Voltage-Min:

    6 V

  • Breakdown Voltage-Nom:

    7.6 V

  • Configuration:

    COMMON ANODE, 4 ELEMENTS, 3 CHANNEL

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JESD-30 Code:

    R-PDSO-F6

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    4

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    BIDIRECTIONAL

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    IEC-61000-4-2; MIL-STD-883G

  • Rep Pk Reverse Voltage-Max:

    5 V

  • Reverse Current-Max:

    0.5 µA

  • Reverse Test Voltage:

    5 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

ESDAULC6-3BP6 Frequently Asked Questions (FAQs)

  • A good PCB layout for ESDAULC6-3BP6 involves keeping the device close to the connector, using a ground plane, and minimizing the length of the signal traces to reduce parasitic inductance and capacitance.
  • To ensure proper soldering, use a soldering iron with a temperature of 250°C to 260°C, and apply a small amount of solder paste to the pads. Avoid overheating the device or applying excessive force, which can damage the internal components.
  • The maximum operating temperature range for ESDAULC6-3BP6 is -40°C to 125°C. Operating the device outside this range may affect its performance and reliability.
  • Yes, ESDAULC6-3BP6 is suitable for high-frequency applications up to 6 GHz. However, it's essential to follow proper PCB layout and design guidelines to minimize signal attenuation and ensure optimal performance.
  • To prevent damage, store ESDAULC6-3BP6 devices in their original packaging or in a conductive bag, and avoid exposing them to electrostatic discharge, moisture, or extreme temperatures during shipping and storage.

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ESDAULC6-3BP6 Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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