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ESDL2012MX4T5G - onsemi

Description: Low Clamping Voltage; Low Insertion Loss (<0.5 dBs @ 20 GHz); X4DFN (0201 - 0.6 x 0.3 mm) package; Stand−off Voltage: 1.0 V; IEC61000−4−2 Level 4 ESD Protection; These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant

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PCB Footprints
ESDL2012MX4T5G - onsemi PCB footprint - Other - Other - ESDL2012MX4T5G-2
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ESDL2012MX4T5G - onsemi  - 3D model - Other - ESDL2012MX4T5G-2
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ESDL2012MX4T5G Details

  • Manufacturer Part Number:

    ESDL2012MX4T5G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DFN-2

  • Package Description:

    X4DFN2, 2 PIN

  • Manufacturer Package Code:

    152AX

  • Country Of Origin:

    Mainland China, Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    onsemi

  • YTEOL:

    7

  • Additional Feature:

    EXCELLENT CLAMPING CAPABILITY, LOW CAPACITANCE

  • Breakdown Voltage-Max:

    2.1 V

  • Breakdown Voltage-Min:

    1.4 V

  • Breakdown Voltage-Nom:

    1.6 V

  • Clamping Voltage-Max:

    7.5 V

  • Configuration:

    SINGLE, 1 CHANNEL

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JESD-30 Code:

    R-PBCC-N2

  • JESD-609 Code:

    e2

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    BIDIRECTIONAL

  • Power Dissipation-Max:

    0.313 W

  • Reference Standard:

    IEC-61000-4-2, 4-5

  • Rep Pk Reverse Voltage-Max:

    1 V

  • Reverse Current-Max:

    0.5 µA

  • Reverse Test Voltage:

    1 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Tin/Silver (Sn/Ag)

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

ESDL2012MX4T5G Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the signal traces short and away from the power plane to minimize noise and EMI.
  • The ESDL2012MX4T5G requires a bias voltage of 5V ± 10% and a bias current of 10mA ± 10%. Ensure the bias voltage is stable and noise-free, and use a low-ESR capacitor to decouple the bias pin.
  • The ESDL2012MX4T5G is rated for operation from -40°C to +125°C. However, the device's performance may degrade at extreme temperatures, so it's essential to ensure proper thermal management and heat dissipation.
  • The ESDL2012MX4T5G has built-in ESD protection, but it's still essential to follow proper ESD handling procedures during assembly and testing. Use an ESD wrist strap or mat, and ensure the device is stored in an ESD-safe environment.
  • Store the ESDL2012MX4T5G in its original packaging or an ESD-safe container. Avoid exposing the device to moisture, extreme temperatures, or physical stress. Handle the device by the body, not the leads, to prevent damage.

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ESDL2012MX4T5G Overview

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