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ESDLC5V0LB-TP - MCC

Description: 15V Clamp 7A (8/20µs) Ipp Tvs Diode Surface Mount 2-DFN1006

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PCB Footprints
ESDLC5V0LB-TP - MCC PCB footprint - Other - Other - ESDLC5V0LB-TP-1
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3D Models
ESDLC5V0LB-TP - MCC  - 3D model - Other - ESDLC5V0LB-TP-1
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ESDLC5V0LB-TP Details

  • Manufacturer Part Number:

    ESDLC5V0LB-TP

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    DFN1006-2, 2 PIN

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    5.97

  • Breakdown Voltage-Max:

    8 V

  • Breakdown Voltage-Min:

    6 V

  • Breakdown Voltage-Nom:

    7 V

  • Clamping Voltage-Max:

    10 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JESD-30 Code:

    R-PBCC-N2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    80 W

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    BIDIRECTIONAL

  • Reference Standard:

    IEC-61000-4-2, 4-4, 4-5

  • Rep Pk Reverse Voltage-Max:

    5.5 V

  • Reverse Current-Max:

    0.2 µA

  • Reverse Test Voltage:

    5.5 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    10

ESDLC5V0LB-TP Frequently Asked Questions (FAQs)

  • The recommended land pattern for ESDLC5V0LB-TP is a rectangular pad with a size of 0.5mm x 0.5mm, with a solder mask clearance of 0.1mm around the pad.
  • Yes, ESDLC5V0LB-TP is rated for operation up to 125°C, making it suitable for high-temperature applications. However, it's essential to ensure that the device is properly derated to prevent overheating.
  • To ensure proper soldering, use a soldering iron with a temperature of 250°C to 260°C, and apply a small amount of solder paste to the pad. Use a soldering technique that minimizes the risk of overheating the device.
  • Yes, ESDLC5V0LB-TP is compatible with lead-free soldering processes, such as SAC305 or Sn96.5Ag3Cu0.5. However, it's essential to follow the recommended soldering profile to prevent damage to the device.
  • The typical response time of ESDLC5V0LB-TP is less than 1ns, making it suitable for high-speed applications where fast response times are critical.

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ESDLC5V0LB-TP Overview

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