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ESDM1051MX4T5G - onsemi

Description: Low Capacitance (21 pF Typ, I/O to GND); Small Body Outline Dimensions − 01005 Size: 0.445 x 0.240 mm; Protection for the Following IEC Standards:IEC 61000−4−2 (Level 4); Low ESD Clamping Voltage; These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant

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ESDM1051MX4T5G - onsemi PCB footprint - Other - Other - ESDM1051MX4T5G-1
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ESDM1051MX4T5G - onsemi  - 3D model - Other - ESDM1051MX4T5G-1
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ESDM1051MX4T5G Details

  • Manufacturer Part Number:

    ESDM1051MX4T5G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    X4DFN-2

  • Package Description:

    X4DFN2, 2 PIN

  • Manufacturer Package Code:

    718AA

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    onsemi

  • YTEOL:

    7

  • Additional Feature:

    EXCELLENT CLAMPING CAPABILITY, LOW CAPACITANCE

  • Breakdown Voltage-Max:

    8.2 V

  • Breakdown Voltage-Min:

    6.1 V

  • Breakdown Voltage-Nom:

    6.8 V

  • Clamping Voltage-Max:

    10 V

  • Configuration:

    SINGLE, 1 CHANNEL

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JESD-30 Code:

    R-PBCC-N2

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    BIDIRECTIONAL

  • Reference Standard:

    IEC-61000-4-2

  • Rep Pk Reverse Voltage-Max:

    5.5 V

  • Reverse Current-Max:

    0.1 µA

  • Reverse Test Voltage:

    5.5 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Tin/Copper/Silver (Sn/Cu/Ag)

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

ESDM1051MX4T5G Frequently Asked Questions (FAQs)

  • A good PCB layout for ESDM1051MX4T5G involves keeping the device close to the protected line, using short traces, and minimizing the distance between the device and the connector. Additionally, a ground plane under the device can help to reduce noise and improve performance.
  • The voltage rating of ESDM1051MX4T5G should be chosen based on the maximum voltage that the device will be exposed to in the application. For example, if the device will be used in a USB interface, a 5V rating would be sufficient, while a 12V rating would be needed for an automotive application.
  • The ESDM1051MX4T5G can handle surge currents up to 30A, making it suitable for protecting against electrostatic discharge (ESD) and other transient events.
  • Yes, ESDM1051MX4T5G can be used for bidirectional protection, meaning it can protect against ESD events on both the input and output lines.
  • The operating temperature range of ESDM1051MX4T5G is -40°C to 125°C, making it suitable for use in a wide range of applications, including automotive and industrial systems.

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