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ESDM3031MXT5G - onsemi

Description: 11 A Peak Pulse Current Capable, 8x20us Surge; 8 V Clamping Voltage @ 10 A, 8x20us Surge; 0201 Form Factor

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PCB Footprints
ESDM3031MXT5G - onsemi PCB footprint - Other - Other - ESD8011MUT5G-1
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3D Models
ESDM3031MXT5G - onsemi  - 3D model - Other - ESD8011MUT5G-1
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ESDM3031MXT5G Details

  • Manufacturer Part Number:

    ESDM3031MXT5G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    X3DFN-2

  • Manufacturer Package Code:

    152AF

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Date Of Intro:

    2017-03-06

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Additional Feature:

    EXCELLENT CLAMPING CAPABILITY, LOW CAPACITANCE, ULTRA LOW CAPACITANCE

  • Breakdown Voltage-Max:

    6.2 V

  • Breakdown Voltage-Min:

    4.4 V

  • Breakdown Voltage-Nom:

    5.3 V

  • Clamping Voltage-Max:

    8 V

  • Configuration:

    SINGLE, 1 CHANNEL

  • Diode Capacitance-Min:

    20 pF

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JESD-30 Code:

    R-PBCC-N2

  • JESD-609 Code:

    e4

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    BIDIRECTIONAL

  • Power Dissipation-Max:

    0.25 W

  • Reference Standard:

    IEC-61000-4-2

  • Rep Pk Reverse Voltage-Max:

    3.3 V

  • Reverse Current-Max:

    0.1 µA

  • Reverse Test Voltage:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    NICKEL PALLADIUM GOLD

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

ESDM3031MXT5G Frequently Asked Questions (FAQs)

  • A good PCB layout for the ESDM3031MXT5G involves keeping the device as close to the connector as possible, using a solid ground plane, and minimizing the length of the signal traces. Additionally, it's recommended to use a common ground point for the device and the connector.
  • To ensure proper soldering, use a soldering iron with a temperature of 250°C to 260°C, and apply a small amount of solder paste to the pads. Use a soldering technique that minimizes the risk of overheating the device, and avoid applying excessive force that could damage the device.
  • The ESDM3031MXT5G is rated for operation from -40°C to 125°C, but it's recommended to operate the device within a temperature range of 0°C to 85°C for optimal performance and reliability.
  • Handle the ESDM3031MXT5G in an ESD-protected environment, wear an ESD wrist strap or use an ESD mat, and avoid touching the device's pins or leads. Use ESD-safe packaging and storage materials, and follow proper ESD handling procedures to prevent damage.
  • Store the ESDM3031MXT5G in a dry, cool place, away from direct sunlight and moisture. The recommended storage temperature range is -40°C to 30°C, and the relative humidity should be below 60%.

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ESDM3031MXT5G Overview

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