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ESDM3051MXT5G - onsemi

Description: 9.9 A Peak Pulse Current Capable, 8x20us Surge; 8.5 V Clamping Voltage @ 9.9 A, 8x20us Surge; 0201 Form Factor

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PCB Footprints
ESDM3051MXT5G - onsemi PCB footprint - Other - Other - ESDM3051MXT5G-3
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ESDM3051MXT5G - onsemi  - 3D model - Other - ESDM3051MXT5G-3
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ESDM3051MXT5G Details

  • Manufacturer Part Number:

    ESDM3051MXT5G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    X3DFN-2

  • Package Description:

    X3DFN-2

  • Manufacturer Package Code:

    152AF

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Date Of Intro:

    2017-03-03

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Additional Feature:

    EXCELLENT CLAMPING CAPABILITY, LOW CAPACITANCE

  • Breakdown Voltage-Max:

    7 V

  • Breakdown Voltage-Min:

    5.1 V

  • Breakdown Voltage-Nom:

    6.05 V

  • Clamping Voltage-Max:

    8.2 V

  • Configuration:

    SINGLE, 1 CHANNEL

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JESD-30 Code:

    R-PBCC-N2

  • JESD-609 Code:

    e4

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Polarity:

    BIDIRECTIONAL

  • Power Dissipation-Max:

    0.25 W

  • Reference Standard:

    IEC-61000-4-2, 4-5

  • Rep Pk Reverse Voltage-Max:

    5 V

  • Reverse Current-Max:

    0.1 µA

  • Reverse Test Voltage:

    5 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

ESDM3051MXT5G Frequently Asked Questions (FAQs)

  • A good PCB layout for the ESDM3051MXT5G involves keeping the device close to the connector, using a ground plane, and minimizing the length of the signal traces. It's also recommended to use a common ground point for the device and the connector.
  • To ensure proper soldering, use a soldering iron with a temperature of 250°C to 260°C, and apply a small amount of solder paste to the pads. Use a soldering technique that minimizes the risk of overheating the device.
  • The ESDM3051MXT5G is rated for operation from -40°C to 125°C, but it's recommended to operate within a temperature range of 0°C to 85°C for optimal performance and reliability.
  • Yes, the ESDM3051MXT5G is designed to operate up to 5 GHz, making it suitable for high-frequency applications such as Wi-Fi, Bluetooth, and other wireless technologies.
  • Handle the ESDM3051MXT5G by the body, avoiding touching the pins or electrical contacts. Store the devices in an anti-static bag or wrap them in anti-static material to prevent electrostatic discharge damage.

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ESDM3051MXT5G Overview

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