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ESDM3051N2T5G - onsemi

Description: 9.9 A Peak Pulse Current Capable, 8x20us Surge; 8.5 V Clamping Voltage @ 9.9 A, 8x20us Surge; 0201 Form Factor

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PCB Footprints
ESDM3051N2T5G - onsemi PCB footprint - Other - Other - X2DFN2_1.0X0.6_CASE_714AB_ISSUE_O
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ESDM3051N2T5G Details

  • Manufacturer Part Number:

    ESDM3051N2T5G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    X2DFN-2

  • Package Description:

    X2DFN-2

  • Manufacturer Package Code:

    714AB

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    4 Weeks

  • Date Of Intro:

    2017-03-03

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Additional Feature:

    EXCELLENT CLAMPING CAPABILITY, LOW CAPACITANCE

  • Breakdown Voltage-Max:

    7 V

  • Breakdown Voltage-Min:

    5.1 V

  • Breakdown Voltage-Nom:

    6.05 V

  • Clamping Voltage-Max:

    8.2 V

  • Configuration:

    SINGLE, 1 CHANNEL

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JESD-30 Code:

    R-PBCC-N2

  • JESD-609 Code:

    e4

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Polarity:

    BIDIRECTIONAL

  • Power Dissipation-Max:

    0.25 W

  • Reference Standard:

    IEC-61000-4-2, 4-5

  • Rep Pk Reverse Voltage-Max:

    5 V

  • Reverse Current-Max:

    0.1 µA

  • Reverse Test Voltage:

    5 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

ESDM3051N2T5G Frequently Asked Questions (FAQs)

  • A good PCB layout for ESDM3051N2T5G involves keeping the device close to the protected line, using short traces, and minimizing the distance between the device and the connector. A ground plane under the device can also help to reduce noise and improve performance.
  • The recommended capacitor value for ESDM3051N2T5G is 1nF to 10nF. The capacitor value should be chosen based on the specific application requirements, such as the frequency of operation and the desired level of ESD protection.
  • The maximum operating temperature range for ESDM3051N2T5G is -40°C to 125°C. However, it's recommended to operate the device within a temperature range of -20°C to 85°C for optimal performance and reliability.
  • Yes, ESDM3051N2T5G is suitable for high-speed data lines, such as USB, HDMI, and Ethernet. The device has a low capacitance of 0.5pF, which minimizes signal distortion and ensures high-speed signal integrity.
  • To ensure proper soldering of ESDM3051N2T5G, follow the recommended soldering profile, use a soldering iron with a temperature of 260°C to 280°C, and apply a small amount of solder paste to the PCB pads. Avoid overheating the device or applying excessive force during soldering.

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ESDM3051N2T5G Overview

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