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ESDSLC5V0AE2-TP - MCC

Description: 25V Clamp 5A (8/20µs) Ipp Tvs Diode Surface Mount 0201-A

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ESDSLC5V0AE2-TP - MCC - PCB symbol
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ESDSLC5V0AE2-TP - MCC PCB footprint - Other - Other - ESDSLC5V0AE2-TP
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ESDSLC5V0AE2-TP - MCC - 3D model - Other - ESDSLC5V0AE2-TP
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ESDSLC5V0AE2-TP Details

  • Manufacturer Part Number:

    ESDSLC5V0AE2-TP

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    6.38

  • Additional Feature:

    ULTRA LOW CAPACITANCE

  • Breakdown Voltage-Min:

    6 V

  • Clamping Voltage-Max:

    25 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JESD-30 Code:

    R-PBCC-N2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    125 W

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    BIDIRECTIONAL

  • Reference Standard:

    IEC-61000-4-2

  • Rep Pk Reverse Voltage-Max:

    5 V

  • Reverse Current-Max:

    0.1 µA

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    10

ESDSLC5V0AE2-TP Frequently Asked Questions (FAQs)

  • The recommended land pattern for ESDSLC5V0AE2-TP is a rectangular pad with a size of 0.5mm x 0.5mm, with a solder mask clearance of 0.1mm around the pad.
  • Yes, ESDSLC5V0AE2-TP is rated for operation up to 150°C, making it suitable for high-temperature applications. However, it's essential to ensure that the device is properly derated for temperature to avoid overheating.
  • To ensure proper soldering, use a soldering iron with a temperature of 250°C to 260°C, and apply a small amount of solder paste to the pad. Use a soldering technique that minimizes the risk of overheating the device.
  • Yes, ESDSLC5V0AE2-TP is compatible with lead-free soldering processes, such as SAC305 or Sn96.5Ag3Cu0.5. However, it's essential to follow the recommended soldering profile to avoid damaging the device.
  • The typical response time of ESDSLC5V0AE2-TP is around 1ns to 2ns, which is fast enough to protect sensitive electronics from ESD events.

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ESDSLC5V0AE2-TP Overview

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