- Datasheet Download Datasheet
- Stock & Prices $ Price & Stock for ESDSLC8V0D3B-TP
- Part Number ESDSLC8V0D3B-TP
- Manufacturer MCC
- Pin Count 2
- Part Category Diode ESD (Bi-directional)
- Package Category Small Outline Diode
- Footprint Name Small Outline Diode - SOD-323 (Thickness 1.15mm)
- Released Date Jan 5, 2024
- Last Modified Date May 17, 2024 4:34 PM UTC
- Pinout / Pin List Click Here (Member Only)
ESDSLC8V0D3B-TP Details
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Manufacturer Part Number:
ESDSLC8V0D3B-TP
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Rohs Code:
Yes
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Part Life Cycle Code:
Active
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Package Description:
SOD-323, 2 PIN
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Country Of Origin:
Mainland China
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ECCN Code:
EAR99
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HTS Code:
8541.10.00.50
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Manufacturer:
Micro Commercial Components
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YTEOL:
6.28
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Breakdown Voltage-Max:
10 V
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Breakdown Voltage-Min:
8.5 V
ESDSLC8V0D3B-TP Frequently Asked Questions (FAQs)
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The recommended PCB layout and land pattern for ESDSLC8V0D3B-TP can be found in the Micro Commercial Components' application note AN-114, which provides guidelines for optimal PCB design and layout to ensure reliable operation and minimize ESD damage.
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The ESDSLC8V0D3B-TP protects against ESD events by using a combination of TVS (Transient Voltage Suppressor) and Zener diodes to clamp and absorb ESD pulses, ensuring that the protected IC is not damaged.
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The maximum operating temperature range for ESDSLC8V0D3B-TP is -40°C to +125°C, as specified in the datasheet. However, it's recommended to operate the device within a temperature range of -20°C to +85°C for optimal performance and reliability.
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Yes, the ESDSLC8V0D3B-TP is designed for ESD protection in high-speed data lines, such as USB, HDMI, and Ethernet. Its low capacitance and high bandwidth make it suitable for protecting high-speed signals from ESD damage.
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To ensure proper soldering and mounting of the ESDSLC8V0D3B-TP, follow the recommended soldering profile and PCB assembly guidelines provided in the datasheet and application notes. Additionally, use a soldering iron with a temperature range of 250°C to 260°C and a solder with a melting point of 217°C to 220°C.
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ESDSLC8V0D3B-TP Overview
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