The recommended land pattern for the ESE22MV21T is a rectangular pad with a size of 2.5mm x 1.5mm, with a solder mask opening of 2.2mm x 1.2mm.
During reflow soldering, the ESE22MV21T should be placed on a flat surface, and the peak reflow temperature should not exceed 260°C. The component should be soldered within 10 seconds of reaching the peak temperature.
The maximum operating temperature range for the ESE22MV21T is -40°C to 125°C.
Yes, the ESE22MV21T is designed to withstand high-vibration environments, with a vibration resistance of 10G (10-2000Hz).
The ESE22MV21T should be stored in a dry, cool place, away from direct sunlight and moisture. If the component is exposed to air for an extended period, it should be baked at 125°C for 24 hours to remove any absorbed moisture.
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ESE22MV21T Overview
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