ESR10EZPJ3R3 footprint, schematic symbol and 3D model by ROHM Semiconductor

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ESR10EZPJ3R3 Details

The recommended land pattern for ESR10EZPJ3R3 is a rectangular pad with a size of 2.5mm x 1.25mm, with a non-solder mask defined (NSMD) pad shape.
To handle thermal considerations, ensure good thermal conduction by using a thermal via or a thermal pad on the PCB, and consider using a heat sink or a thermal interface material (TIM) if necessary.
The maximum operating temperature range for ESR10EZPJ3R3 is -55°C to +125°C, but it's recommended to operate within -40°C to +85°C for optimal performance and reliability.
To ensure reliability in high-vibration environments, use a secure mounting method, such as soldering or using a screw, and consider using a vibration-dampening material or a shock-absorbing mount.
Store ESR10EZPJ3R3 in a dry, cool place, away from direct sunlight, moisture, and extreme temperatures. The recommended storage temperature range is -10°C to +30°C, and the recommended humidity range is 20% to 80% RH.

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